LSM330DLC STMicroelectronics

LSM330DLC iNEMO inertial module: 3D accelerometer and 3D gyroscope Datasheet production data Features Analog supply voltage: 2.4 V to 3.6 V Digital supply voltage IOs: 1.8 V Low power mode Power-down mode LGA-28L (4x5x1.1 mm) 3 independent acceleration channels and 3 angular rate channels The various sensing elements are manufactured using specialized micromachining processes, 2 g/4 g/8 g/16 g dynamically selectable while the IC interfaces are developed using a full scale CMOS technology that allows the design of a 250/500/2000 dps dynamically selectable dedicated circuit which is trimmed to better match full scale the sensing element characteristics. 2 SPI/I C serial interface (16-bit data output) The LSM330DLC has dynamically user- Programmable interrupt generator for free-fall selectable full scale acceleration range of and motion detection 2 g/4 g/8 g/16 g and angular rate of ECOPACK RoHS and Green compliant 250/500/2000 deg/sec. The accelerometer and gyroscope sensors can Application be either activated or separately put in Low power/Power-down mode for applications GPS navigation systems optimized for power saving. Impact recognition and logging The LSM330DLC is available in a plastic land grid Gaming and virtual reality input devices array (LGA) package. Motion activated functions Table 1. Device summary Intelligent power saving for handheld devices Vibration monitoring and compensation Temperature Part number Package Packing range C Free-fall detection LSM330DLC -40 to +85 Tray 6D orientation detection LGA-28L (4x5x1.1 Tape LSM330DLCTR -40 to +85 mm) and reel Description The LSM330DLC is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope. STs family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers. September 2012 Doc ID 022162 Rev 2 1/66 This is information on a product in full production. www.st.com 66Contents LSM330DLC Contents 1 Block diagram and pin description . 7 1.1 Block diagram . 7 1.2 Pin description 8 2 Module specifications . 10 2.1 Mechanical characteristics 10 2.2 Electrical characteristics 11 2.3 Temperature sensor characteristics . 12 2.4 Communication interface characteristics . 13 2.4.1 SPI - serial peripheral interface . 13 2.4.2 I2C - inter IC control interface 14 2.5 Absolute maximum ratings 15 3 Terminology . 16 3.1 Sensitivity . 16 3.2 Zero-g level 16 4 Functionality 17 4.1 Normal mode, Low power mode . 17 4.1.1 Self-test . 17 4.1.2 6D/4D orientation detection 17 4.1.3 Sleep-to-wake and Return to sleep 18 4.2 Linear acceleration digital main blocks . 18 4.2.1 FIFO 18 4.2.2 Bypass mode . 18 4.2.3 FIFO mode . 18 4.2.4 Stream mode . 18 4.2.5 Stream-to-FIFO mode 19 4.2.6 Retrieve data from FIFO 19 4.3 Gyroscope digital main blocks . 19 4.4 FIFO . 20 4.4.1 Bypass mode . 20 4.4.2 FIFO mode . 20 2/66 Doc ID 022162 Rev 2