LSM330TR STMicroelectronics

LSM330 iNEMO inertial module: 3D accelerometer and 3D gyroscope Datasheet - production data Description The LSM330 is a system-in-package featuring a 3D digital accelerometer with two embedded state machines that can be programmed to implement autonomous applications and a 3D digital LGA-24L (3x3.5x1 mm) gyroscope. STs family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. Features The various sensing elements are manufactured Analog supply voltage: 2.4 V to 3.6 V using specialized micromachining processes, Digital supply voltage IOs: 1.8 V while the IC interfaces are developed using CMOS technology that allows the design of a Power-down and sleep modes dedicated circuit which is trimmed to better match 2 embedded programmable state machines the sensing element characteristics. 3 independent acceleration channels and 3 The LSM330 has a user-selectable full-scale angular rate channels acceleration range of 2/4/6/8/16 g and an 2/4/6/8/16 g selectable full scale angular rate range of 250/500/2000 dps. The 250/500/2000 dps selectable full scale accelerometer and gyroscope sensors can be 2 either activated or separately put in power-down / SPI/I C serial interface sleep mode for applications optimized for power Embedded temperature sensor saving. Embedded FIFO The LSM330 is available in a plastic land grid ECOPACK RoHS and Green compliant array (LGA) package. Applications Table 1. Device summary Part Temperature GPS navigation systems Package Packing number range C Impact recognition and logging LSM330 -40 to +85 Tray Gaming and virtual reality input devices LGA-24L Tape Motion-activated functions (3x3.5x1mm) LSM330TR -40 to +85 and reel Intelligent power saving for handheld devices Vibration monitoring and compensation Free-fall detection 6D orientation detection December 2013 DocID023426 Rev 3 1/75 This is information on a product in full production. www.st.comContents LSM330 Contents 1 Block diagram and pin description 11 1.1 Block diagram 11 1.2 Pin description . 12 2 Module specifications . 14 2.1 Mechanical characteristics 14 2.2 Electrical characteristics 15 2.3 Temperature sensor characteristics . 15 2.4 Communication interface characteristics . 16 2.4.1 SPI - serial peripheral interface . 16 2 2.4.2 I C - inter-IC control interface 17 2.5 Absolute maximum ratings 18 3 Terminology . 19 3.1 Sensitivity . 19 3.2 Zero-g and zero rate level 19 4 Functionality 20 4.1 Power modes 20 4.2 Linear acceleration sensor digital main blocks . 20 4.2.1 State machine 20 4.2.2 FIFO 21 4.2.3 Bypass mode . 22 4.2.4 FIFO mode . 22 4.2.5 Stream mode . 22 4.2.6 Stream-to-FIFO mode 23 4.2.7 Bypass-to-Stream mode 23 4.2.8 Retrieving data from FIFO . 23 4.3 Angular rate sensor digital main blocks 24 4.3.1 FIFO 24 4.3.2 Bypass mode . 25 4.3.3 FIFO mode . 25 4.3.4 Stream mode . 26 2/75 DocID023426 Rev 3