LSM6DS0 STMicroelectronics

LSM6DS0 iNEMO inertial module: 3D accelerometer and 3D gyroscope Datasheet - production data Description The LSM6DS0 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope. STs family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of LGA-16L (3x3x0.86 mm) micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, Features while the IC interfaces are developed using CMOS technology that allows the design of a Analog supply voltage: 1.71 V to 3.6 V dedicated circuit which is trimmed to better match Independent IOs supply (1.71 V) the sensing element characteristics. Always on eco power mode down to 1.8 mA The LSM6DS0 has a full-scale acceleration range of 2/4/8/16 g and an angular rate range of 3 independent acceleration channels and 3 245/500/2000 dps. The LSM6DS0 has two angular rate channels operating modes in that the accelerometer and 2/4/8/16 g full scale gyroscope sensors can be either activated at the 245/500/2000 dps full scale same ODR or the accelerometer can be enabled 2 while the gyroscope is in power-down. SPI/I C serial interface Embedded temperature sensor The LSM6DS0 is available in a plastic land grid array (LGA) package. Embedded FIFO ECOPACK , RoHS and Green compliant Table 1. Device summary Applications Temp. Part number Package Packing range C GPS navigation systems LSM6DS0 -40 to +85 Tray Impact recognition and logging LGA-16L Tape (3x3x0.86 mm) Gaming and virtual reality input devices LSM6DS0TR -40 to +85 and reel Motion-activated functions Intelligent power saving for handheld devices Vibration monitoring and compensation Free-fall detection 6D orientation detection November 2014 DocID025604 Rev 3 1/59 This is information on a product in full production. www.st.comContents LSM6DS0 Contents 1 Pin description . 8 2 Module specifications . 10 2.1 Mechanical characteristics 10 2.2 Electrical characteristics 12 2.2.1 Recommended power-up sequence . 12 2.3 Temperature sensor characteristics . 13 2.4 Communication interface characteristics . 14 2.4.1 SPI - serial peripheral interface . 14 2 2.4.2 I C - inter-IC control interface 15 2.5 Absolute maximum ratings 16 2.6 Terminology . 17 2.6.1 Sensitivity 17 2.6.2 Zero-g and zero rate level . 17 3 Functionality 18 3.1 Operating modes . 18 3.2 Gyroscope power modes . 18 3.3 Multiple reads (burst) 20 3.4 Digital block diagram 21 3.5 FIFO . 22 3.5.1 Bypass mode . 22 3.5.2 FIFO mode . 23 3.5.3 Continuous mode 23 3.5.4 Continuous-to-FIFO mode . 24 3.5.5 Bypass-to-Continuous mode . 25 4 Digital interfaces . 26 2 4.1 I C serial interface 26 2 4.1.1 I C operation . 27 4.2 SPI bus interface . 28 4.2.1 SPI read . 29 4.2.2 SPI write 30 2/59 DocID025604 Rev 3