LSM6DS3USTR STMicroelectronics

LSM6DS3US iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope Datasheet - production data Description The LSM6DS3US is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope LGA-14L performing at 1.1 mA (up to 1.6 kHz ODR) in high- (2.5 x 3 x 0.83 mm) typ. performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. Features The LSM6DS3US supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte Power consumption: 0.85 mA in combo normal FIFO + flexible 4 kbyte (FIFO or programmable) for mode and 1.1 mA in combo high-performance mode dynamic data batching. up to 1.6 kHz. Always-on experience with low power The LSM6DS3US gyroscope supports both OIS/EIS consumption for both accelerometer and gyroscope applications. The device can be connected to the 2 camera module through a dedicated auxiliary SPI Interface flexibility: selectable SPI (3/4-wire) or I C (Mode 3) while flexibility for the primary interface is with the main processor 2 available (I C/SPI). Auxiliary SPI (3-wire) to support OIS applications STs family of MEMS sensor modules leverages the EIS/OIS support robust and mature manufacturing processes already Accelerometer ODR up to 6.66 kHz used for the production of micromachined Gyroscope ODR up to 3.33 kHz accelerometers and gyroscopes. Smart FIFO The various sensing elements are manufactured using 2/4/8/16 g full scale specialized micromachining processes, while the IC interfaces are developed using CMOS technology that 125/250/500/1000/2000 dps full scale allows the design of a dedicated circuit which is Analog supply voltage: 1.71 V to 3.6 V trimmed to better match the characteristics of the Independent IOs supply (1.62 V) sensing element. Compact footprint, 2.5 mm x 3 mm x 0.83 mm The LSM6DS3US has a full-scale acceleration range of 2 SPI/I C serial interface data synchronization feature 2/4/8/16 g and an angular rate range of 125/250/500/1000/2000 dps. Embedded temperature sensor ECOPACK , RoHS and Green compliant High robustness to mechanical shock makes the LSM6DS3US the preferred choice of system designers for the creation and manufacturing of reliable products. Applications The LSM6DS3US is available in a plastic land grid EIS and OIS for camera applications array (LGA) package. Collecting sensor data Motion tracking and gesture detection Table 1. Device summary Pedometer, step detector and step counter Temp. Part number Package Packing Significant motion and tilt functions range C Indoor navigation LGA-14L Tape & LSM6DS3USTR -40 to +85 IoT and connected devices (2.5 x 3 x 0.83 mm) Reel Vibration monitoring and compensation September 2017 DocID028476 Rev 5 1/105 This is information on a product in full production. www.st.comContents LSM6DS3US Contents 1 Overview . 15 2 Embedded low-power features . 16 2.1 Tilt detection . 16 3 Pin description 17 3.1 Pin connections 18 4 Module specifications . 20 4.1 Mechanical characteristics 20 4.2 Electrical characteristics 23 4.3 Temperature sensor characteristics . 24 4.4 Communication interface characteristics . 25 4.4.1 SPI - serial peripheral interface . 25 2 4.4.2 I C - inter-IC control interface 26 4.5 Absolute maximum ratings 27 4.6 Terminology . 28 4.6.1 Sensitivity 28 4.6.2 Zero-g and zero-rate level . 28 5 Functionality 29 5.1 Operating modes . 29 5.2 Gyroscope power modes . 29 5.3 Accelerometer power modes 29 5.4 Interface flexibility with auxiliary SPI 30 5.5 FIFO . 31 5.5.1 Bypass mode . 32 5.5.2 FIFO mode . 32 5.5.3 Continuous mode 32 5.5.4 Continuous-to-FIFO mode . 32 5.5.5 Bypass-to-Continuous mode . 33 5.5.6 FIFO reading procedure 33 5.5.7 Filter block diagrams . 33 2/105 DocID028476 Rev 5