MP34DT02 MEMS audio sensor omnidirectional digital microphone Datasheet - production data Speech recognition A/V eLearning devices Gaming and virtual reality input devices Digital still and video cameras Antitheft systems Description The MP34DT02 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built HCLGA (3 x 4 x 1.06) mm 4LD with a capacitive sensing element and an IC interface. Features The sensing element, capable of detecting acoustic waves, is manufactured using a Single supply voltage specialized silicon micromachining process dedicated to produce audio sensors. Low power consumption 120 dBSPL acoustic overload point The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit 60 dB signal-to-noise ratio able to provide a digital signal externally in PDM Omnidirectional sensitivity format. 26 dBFS sensitivity The MP34DT02 has an acoustic overload point of PDM output 120 dBSPL with a 60 dB signal-to-noise ratio and 26 dBFS sensitivity. HCLGA package Top-port design The MP34DT02 is available in a top-port, SMD- SMD-compliant compliant, EMI-shielded package and is guaranteed to operate over an extended EMI-shielded temperature range from -40 C to +85 C. ECOPACK , RoHS, and Green compliant Applications Mobile terminals Laptop and notebook computers Portable media players VoIP Table 1. Device summary Order codes Temperature range C Package Packing MP34DT02 -40 to +85 HCLGA (3 x 4 x 1.06) mm 4LD Tray MP34DT02TR -40 to +85 HCLGA (3 x 4 x 1.06) mm 4LD Tape and reel September 2014 DocID026560 Rev 2 1/16 This is information on a product in full production. www.st.comContents MP34DT02 Contents 1 Pin description . 3 2 Acoustic and electrical specifications 4 2.1 Acoustic and electrical characteristics 4 2.2 Frequency response 5 3 Application recommendations . 6 3.1 Timing characteristics . 7 4 Sensing element 8 5 Absolute maximum ratings . 9 6 Functionality 10 6.1 L/R channel selection 10 7 Package mechanical data 11 8 Carrier tape mechanical specifications . 13 9 Process recommendations 14 10 Revision history . 15 2/16 DocID026560 Rev 2