MP34DB01TR STMicroelectronics

MP34DB01 MEMS audio sensor omnidirectional digital microphone Datasheet production data Features Single supply voltage Low power consumption 120 dBSPL acoustic overload point 62.6 dB signal-to-noise ratio Omnidirectional sensitivity RHLGA 3x4x1 4LD 26 dBFS sensitivity PDM single-bit output with option for stereo configuration Description RHLGA package The MP34DB01 is an ultra-compact, low-power, Bottom-port design omnidirectional, digital MEMS microphone built SMD-compliant with a capacitive sensing element and an IC EMI-shielded interface with stereo operation capability. ECOPACK , RoHS and Green compliant The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process Applications dedicated to produce audio sensors. Mobile terminals The IC interface is manufactured using a CMOS Laptop and notebook computers process that allows designing a dedicated circuit Portable media players able to provide a digital signal externally in PDM format. VoIP The MP34DB01 has an acoustic overload point of Speech recognition 120 dBSPL with a best on the market 62.6 dB A/V eLearning devices signal-to-noise ratio and -26 dBFS sensitivity. Gaming and virtual reality input devices The MP34DB01 is available in a bottom-port, Digital still and video cameras SMD-compliant, EMI-shielded package and is Antitheft systems guaranteed to operate over an extended temperature range from -40 C to +85 C. Table 1. Device summary Part number Temperature range C Package Packing MP34DB01 -40 to +85 RHLGA (3x4x1) mm 4LD Tray MP34DB01TR -40 to +85 RHLGA (3x4x1) mm 4LD Tape and reel July 2012 Doc ID 17924 Rev 8 1/16 This is information on a product in full production. www.st.com 1Contents MP34DB01 Contents 1 Pin description . 5 2 Acoustic and electrical specifications 6 2.1 Acoustic and electrical characteristics 6 2.2 Timing characteristics 7 2.3 Frequency response 8 3 Sensing element 9 4 Absolute maximum ratings 10 5 Functionality 11 5.1 L/R channel selection 11 6 Application recommendations 12 7 Package mechanical data 13 8 Revision history . 15 2/16 Doc ID 17924 Rev 8