X-On Electronics has gained recognition as a prominent supplier of EV_INV-ARM Multiple Function Sensor Development Tools across the USA, India, Europe, Australia, and various other global locations. EV_INV-ARM Multiple Function Sensor Development Tools are a product manufactured by TDK. We provide cost-effective solutions for Multiple Function Sensor Development Tools, ensuring timely deliveries around the world.

EV_INV-ARM TDK

EV_INV-ARM electronic component of TDK
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Part No.EV_INV-ARM
Manufacturer: TDK
Category: Multiple Function Sensor Development Tools
Description: Multiple Function Sensor Development Tools InvenSense ARM Board
Datasheet: EV_INV-ARM Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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MOQ : 1
Multiples : 1
1 : USD 58.2942
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Multiples : 1
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MOQ : 1
Multiples : 1
1 : USD 64.233
5 : USD 61.8228
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We are delighted to provide the EV_INV-ARM from our Multiple Function Sensor Development Tools category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the EV_INV-ARM and other electronic components in the Multiple Function Sensor Development Tools category and beyond.

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Application Note InvenSense Motion Sensor Universal Evaluation Board (UEVB) User Guide PURPOSE This document describes the hardware and circuitry on the Universal Evaluation Board (UEVB). The UEVB is used to evaluate most of InvenSenses current motion sensing (gyroscopes, accelerometers, magnetometers) products. It covers applying the UEVB to a larger system, and requires the understanding of key signals and circuit functions, hardware jumper settings, and port connections. USAGE This UEVB provides up to nine axes of motion sensing comprised of: Digital-output of 3-axis gyroscope with user-programmable full-scale ranges Digital-output of 3-axis accelerometer with user-programmable full-scale ranges Digital-output of 3-axis magnetometer On-chip temperature sensor Data is measured using on-chip ADCs and is transmitted over IC or SPI interfaces The UEVB may be used by itself utilizing SPI or IC serial communications interfaces. Alternatively, it may be connected to the InvenSense ARM Controller Board for connectivity to a host computer via USB interface. The UEVB was designed to support up to 9-axis MPUs (Motion Processing Units) with a built-in compass (MPU- 91xx and MPU-92xx). Connecting an external compass board to the UEVB may require the user to connect their 2 third-party compass to the UEVB via its auxiliary I C bus. The UEVB is populated with an external compass, and can 2 access the main or auxiliary I C bus lines provided by the sensor (AUX DA and AUX CL) via resistor options. The UEVB is lead-free and RoHS compliant. RELATED DOCUMENTS Please refer to the product specification of the main motion sensor for electrical characteristics, pinout and applications details. Sensor product specifications can be found at www.invensense.com. For product specifications for unreleased parts, please contact the InvenSense sales department at sales invensense.com. InvenSense Inc. InvenSense reserves the right to change the Document Number: AN-IVS-0001EVB-00 1745 Technology Drive, San Jose, CA 95110 U.S.A detail specifications as may be required to Rev Number: 1.2 +1(408) 9887339 permit improvements in the design of its Rev Date: 11/07/2014 www.invensense.com products. UEVB TABLE OF CONTENTS PURPOSE............................................................................................................................................................................................ 1 USAGE ............................................................................................................................................................................................ 1 RELATED DOCUMENTS ............................................................................................................................................................... 1 UEVB OVERVIEW .............................................................................................................................................................................. 3 TABLE 1A. PARTS FOR UEVB FOOTPRINTS ............................................................................................................................... 3 TABLE 1B. RESISTOR OPTIONS ................................................................................................................................................... 4 KEY FUNCTIONS AND PINOUTS.................................................................................................................................................. 6 2 I C/SPI BUS CONNECTIONS......................................................................................................................................................... 6 SCHEMATIC ....................................................................................................................................................................................... 7 BILL OF MATERIAL (BO M) ............................................................................................................................................................... 8 TABLE 2A. BILL OF MATERIAL FOR U1A .................................................................................................................................... 8 TABLE 2B. BILL OF MATERIAL FOR U1B..................................................................................................................................... 8 TABLE 2C. BILL OF MATERIAL FOR U1C..................................................................................................................................... 9 TABLE 2D. BILL OF MATERIAL FOR U1D, OPTION-A................................................................................................................ 9 TABLE 2E. BILL OF MATERIAL FOR U1D, OPTION-B ..............................................................................................................10 POWER SUPPLY CONNECTIONS ...................................................................................................................................................11 TABLE 3. POWER SELECTION JUMPERS (JP1, JP2).................................................................................................................11 UEVB CONNECTOR SIGNALS DESCRIPTION................................................................................................................................12 TABLE 4. USER INTERFACE CONNECTOR SIGNALS (CN1) .....................................................................................................12 CONNECTING THE FSYNC LINE.................................................................................................................................................13 SERIAL BUS LEVELS, SPEEDS, AND TERMINATIONS ..............................................................................................................13 DATA GATHERING OPTIONS .........................................................................................................................................................14 CONNECTION TO THE INVENSENSE ARM CONTROLLER BOARD........................................................................................14 USE OF THE UEVB WITHOUT AN ARM CONTROLLER BOARD .............................................................................................14 SPECIAL INSTRUCTIONS ................................................................................................................................................................15 ELECTROSTATIC DISCHARGE SENSITIVITY..............................................................................................................................15 BOARD LAYOUT AND FOOTPRINT DISCUSSION ....................................................................................................................15 REVISION HISTORY.....................................................................................................................................................................17 Document Numb er: AN- IVS-0001EVB-00 Page 2 of 18 Rev Number: 1.2 Rev Date: 11/07/2014

Tariff Desc

8543.70.00 - Other machines and apparatus Free
13 No Signal processors (graphic equalisers, crossovers etc.)
91 .. Other

9027.10.00 Instruments and apparatus for physical or chemical analysis (for example, polarimeters, refractometers, spectrometers, gas or smoke analysis apparatus); instruments and apparatus for measuring or checking viscosity, porosity, expansion, surface tension or the like; instruments and apparatus for measuring or checking quantities of heat, sound or light (including exposure meters); microtomes.
EPC
EPCOS
EPCOS TDK
EPCOS (TDK)
EPCOS / TDK
EPCOS Inc
EPCOS/TDK
EPO
InvenSense
Micronas
Micronas GmbH
TD4
TDK Corporation
TDK ELECTRONICS
TDK INNOVETA
TDK InvenSense
TDK LAMBDA
TDK SEMICONDUCTOR
TDK-Lambda Americas Inc
TDK-Lambda Americas Inc.
TDK-Lambda Americas Inc. [CI] (VA)
TDK-Micronas
tronics
Tronics / TDK
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