FSYNC RESV RESV INT ICM-20602 High Performance 6-Axis MEMS MotionTracking Device General Description Applications The ICM-20602 is a 6-axis MotionTracking device that Smartphones and Tablets combines a 3-axis gyroscope, 3-axis accelerometer, in a small Wearable Sensors 3 mm x 3 mm x 0.75 mm (16-pin LGA) package. IoT Applications Motion-based game controllers High performance specs 3D remote controls for Internet connected DTVs and o Gyroscope sensitivity error: 1% set top boxes, 3D mice o Gyroscope noise: 4 mdps/ Hz o Accelerometer noise: 100 g/ Hz Features Includes 1 KB FIFO to reduce traffic on the serial bus 3-Axis Gyroscope with Programmable FSR of 250 interface, and reduce power consumption by allowing the dps, 500 dps, 1000 dps, and 2000 dps system processor to burst read sensor data and then go 3-Axis Accelerometer with Programmable FSR of 2g, into a low-power mode 4g, 8g, and 16g EIS FSYNC support User-programmable interrupts Wake-on-motion interrupt for low power operation ICM-20602 includes on-chip 16-bit ADCs, programmable of applications processor digital filters, an embedded temperature sensor, and 1 KB FIFO buffer enables the applications processor to programmable interrupts. The device features an operating read the data in bursts 2 voltage range down to 1.71V. Communication ports include I C On-Chip 16-bit ADCs and Programmable Filters and high speed SPI at 10 MHz. 2 Host interface: 10 MHz SPI or 400 kHz Fast Mode I C Digital-output temperature sensor Ordering Information VDD operating range of 1.71V to 3.45V MEMS structure hermetically sealed and bonded at PART TEMP RANGE PACKAGE wafer level ICM-20602 40C to +85C 16-Pin LGA RoHS and Green compliant Denotes RoHS and Green-Compliant Package Typical Operating Circuit Block Diagram 1.71 3.45VDC VDD C2, 0.1 mF C4, 2.2 mF REGOUT 16 15 14 C1, 0.1 mF AP/HUB 1.71 3.45 VDC VDDIO GND M 1 13 RESV C3, 10 nF SCL/SPC SCL 2 12 SPI/I2C SDA/SDI RESV SDA ICM-20602 3 11 SA0/SDO RESV AD0 S 4 10 VDDIO CS RESV 5 9 FSYNC for EIS 6 7 8 ICM-20602 Main PCB InvenSense Inc. InvenSense reserves the right to change the detail Document Number: DS-000176 1745 Technology Drive, San Jose, CA 95110 U.S.A specifications as may be required to permit Revision: 1.0 +1(408) 9887339 improvements in the design of its products. Revision Date: 10/03/2016 www.invensense.com ICM-20602 TABLE OF CONTENTS General Description ............................................................................................................................................. 1 Ordering Information ........................................................................................................................................... 1 Block Diagram ...................................................................................................................................................... 1 Applications ......................................................................................................................................................... 1 Features ............................................................................................................................................................... 1 Typical Operating Circuit ...................................................................................................................................... 1 1 Introduction ......................................................................................................................................................... 7 1.1 Purpose and Scope .................................................................................................................................... 7 1.2 Product Overview...................................................................................................................................... 7 1.3 Applications ............................................................................................................................................... 7 2 Features ............................................................................................................................................................... 8 2.1 Gyroscope Features .................................................................................................................................. 8 2.2 Accelerometer Features ............................................................................................................................ 8 2.3 Additional Features ................................................................................................................................... 8 3 Electrical Characteristics ...................................................................................................................................... 9 3.1 Gyroscope Specifications .......................................................................................................................... 9 3.2 Accelerometer Specifications .................................................................................................................. 10 3.3 Electrical Specifications ........................................................................................................................... 11 2 3.4 I C Timing Characterization ..................................................................................................................... 14 3.5 SPI Timing Characterization .................................................................................................................... 15 3.6 Absolute Maximum Ratings .................................................................................................................... 16 4 Applications Information ................................................................................................................................... 17 4.1 Pin Out Diagram and Signal Description ................................................................................................. 17 4.2 Typical Operating Circuit ......................................................................................................................... 18 4.3 Bill of Materials for External Components .............................................................................................. 18 4.4 Block Diagram ......................................................................................................................................... 19 4.5 Overview ................................................................................................................................................. 19 4.6 Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning ............................................... 20 4.7 Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning ......................................... 20 2 4.8 I C and SPI Serial Communication Interfaces .......................................................................................... 20 4.9 Self-Test................................................................................................................................................... 21 4.10 Clocking ............................................................................................................................................... 21 4.11 Sensor Data Registers ......................................................................................................................... 21 4.12 FIFO ..................................................................................................................................................... 22 4.13 Interrupts ............................................................................................................................................ 22 4.14 Digital-Output Temperature Sensor ................................................................................................... 22 4.15 Bias and LDOs ..................................................................................................................................... 22 4.16 Charge Pump ...................................................................................................................................... 22 Document Number: DS-000176 Page 2 of 57 Revision: 1.0 Revision Date: 10/03/2016