CMS08(TE12L,Q,M) Toshiba

CMS08 TOSHIBA Schottky Barrier Diode CMS08 DC-DC Converters Unit: mm Radio-Frequency Rectification in Switching Regulators Reverse-Current Protection in Mobile Devices Repetitive peak reverse voltage : V = 30 V RRM Average forward current : I = 1.0 A F (AV) Peak forward voltage : V = 0.37 V (max) FM Suitable for high-density board assembly due to the use of a small TM Toshiba Nickname: M FLAT Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit 1 ANODE Repetitive peak reverse voltage V 30 V RRM 2 CATHODE Average forward current 1.0 (Note 1) A I F (AV) Non-repetitive peak forward surge current I 25 (50 Hz) A FSM Junction temperature T 40 to 125 C j JEDEC Storage temperature T 40 to 150 C stg JEITA Note 1: T = 106C Rectangular waveform : = 180, VR = 15 V TOSHIBA 3-4E1S Ta = 51C Device mounted on a ceramic board board size : 50 mm 50 mm Weight: 0.023 g (typ.) soldering land size : 2 mm 2 mm board thickness : 0.64 mm Rectangular waveform : = 180, VR = 15 V Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. Max Unit V I = 0.1 A (pulse test) 0.23 FM (1) FM Peak forward voltage V I = 0.5 A (pulse test) 0.29 V FM (2) FM V I = 1.0 A (pulse test) 0.32 0.37 FM (3) FM I V = 5 V (pulse test) 0.04 RRM (1) RRM Repetitive peak reverse current mA I V = 30 V (pulse test) 0.38 1.5 RRM (2) RRM Junction capacitance C V = 10 V, f = 1.0 MHz 70 pF j R Device mounted on a ceramic board board size 50 mm 50 mm 60 soldering land size 2 mm 2 mm board thickness 0.64 mm Thermal resistance R C/W th (j-a) (junction to ambient) Device mounted on a glass-epoxy board board size 50 mm 50 mm 135 soldering land size 6 mm 6 mm board thickness 1.6 mm Thermal resistance (junction to lead) R 16 C/W th (j-) Start of commercial production 2000-07 1 2019-03-07 CMS08 Marking Abbreviation Code Part No. S8 CMS08 Land pattern dimensions for reference only Unit: mm 1.4 3.0 1.4 Usage Considerations 1) Schottky barrier diodes have reverse current characteristic compared to the other diodes. There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage. This device is V -I trade-off type, lower V higher I therefore, thermal runaway might occur when voltage is F RRM F RRM applied. Please take forward and reverse loss into consideration during design. 2) The absolute maximum ratings are rated values that must not be exceeded for a moment to have you use an element safely. Please refer to each following absolute maximum ratings on the occasion of use and design. V : V has a temperature coefficient of 0.1 %/. RRM RRM Please take this coefficient into account when designing a circuit board that will be operated in a low-temperature environment. I : We recommend that the current be in less than 80 % of rating and the junction temperature (T ) F(AV) j be in less than 80 % of absolute maximum rating under the worst condition. This rating is based on the premise that the device is radiating heat enough. Therefore, when enough heat radiation is not expected, please consider the margin to the permission curve of T - I for using the device. a(max) F(AV) I : This rating specifies a non-repetitive limit value. FSM This only applies to an abnormal operation, which seldom occurs during the lifespan of a device. T : Derate device parameters in proportion to this rating in order to ensure high reliability. j We recommend that the junction temperature (T ) of a device be kept below 80 %. j 3) Thermal resistance (junction-to-ambient) varies with the mounting conditions of the device on the circuit board. An appropriate thermal resistance value that should be used, must be considering the circuit board design and soldering land size. 4) For other design considerations, see the Toshiba website. 2 2019-03-07 2.1