CRS09
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CRS09
Switching Mode Power Supply Applications
Unit: mm
Portable Equipment Battery Applications
Forward voltage: V = 0.46 V (max)
FM
Average forward current: I = 1.5 A
F (AV)
Repetitive peak reverse voltage: V = 30 V
RRM
Suitable for compact assembly due to small surface-mount package
TM
SFLAT (Toshiba package name)
Absolute Maximum Ratings (Ta = 25C)
Characteristics Symbol Rating Unit
Repetitive peak reverse voltage V 30 V
RRM
Average forward current I 1.5 (Note 1) A
F (AV)
Peak one cycle surge forward current
I 30 (50 Hz) A
FSM
(non-repetitive)
Junction temperature T 40~150 C
j
Storage temperature T 40~150 C
stg
JEDEC
JEITA
Note 1: Ta = 84C
Device mounted on a ceramic board
TOSHIBA 3-2A1A
(board size: 50 mm 50 mm, land size: 2 mm 2 mm)
Weight: 0.013 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25C)
Characteristics Symbol Test Condition Min Typ. MaxUnit
V I = 0.1 A 0.35
FM (1) FM
Peak forward voltage V
V I = 1.0 A 0.415
FM (2) FM
V I = 1.5 A 0.43 0.46
FM (3) FM
I V = 5 V 0.8
RRM (1) RRM
Repetitive peak reverse current A
I V = 30 V 10 50
RRM (2) RRM
Junction capacitance C V = 10 V, f = 1.0 MHz 90 pF
j R
Device mounted on a ceramic board
70
(soldering land: 2 mm 2 mm)
Thermal resistance (junction to ambient) R C/W
th (j-a)
Device mounted on a glass-epoxy
board 140
(soldering land: 6 mm 6 mm)
Thermal resistance (junction to lead) R 20 C/W
th (j-)
Start of commercial production
2000-04
1 2013-11-01 CRS09
Marking
Abbreviation Code Part No.
S9 CRS09
Standard Soldering Pad
Unit: mm
1.2
1.2
2.8
Handling Precaution
Schottky barrier diodes have reverse current characteristics compared to other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we recommend
when you design a circuit with a device.
V : Use this rating with reference to the above. V has a temperature coefficient of 0.1%/C. Take
RRM RRM
this temperature coefficient into account designing a device at low temperature.
I : We recommend that the worst case current be no greater than 80% of the absolute maximum rating
F(AV)
of I and T be below 120C. When using this device, take the margin into consideration by
F(AV) j
using an allowable Tamax-I curve.
F(AV)
I : This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation,
FSM
which seldom occurs during the lifespan of the device.
T : Derate this rating when using a device in order to ensure high reliability. We recommend that the
j
device be used at a T of below 120C.
j
Thermal resistance between junction and ambient fluctuates depending on the devices mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
2 2013-11-01