SSM3K318R MOSFETs Silicon N-Channel MOS SSM3K318RSSM3K318RSSM3K318RSSM3K318R 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Load Switches Ultra-High-Speed Switching 2. 2. 2. 2. FeaturesFeaturesFeaturesFeatures (1) 4.5-V gate drive voltage. (2) Low drain-source on-resistance R = 145 m (max) ( V = 4.5 V) DS(ON) GS R = 107 m (max) ( V = 10 V) DS(ON) GS 3. 3. Packaging and Pin AssignmentPackaging and Pin Assignment 3. 3. Packaging and Pin AssignmentPackaging and Pin Assignment 1: Gate 2: Source 3: Drain SOT-23F Start of commercial production 2015-02 2016 Toshiba Corporation 2016-08-23 1 Rev.2.0SSM3K318R 4. 4. 4. 4. Absolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, T = 25 = 25 = 25 = 25 )))) aaaa Characteristics Symbol Rating Unit Drain-source voltage V 60 V DSS Gate-source voltage V 20 GSS Drain current (Note 1) I 2.5 A D Drain current (pulsed) (Note 1) I 5 DP Power dissipation (Note 2) P 1 W D Power dissipation (t = 10 s) (Note 2) P 2 D Channel temperature T 150 ch Storage temperature T -55 to 150 stg Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook Handling PrecautionDerating Concept and Method) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Ensure that the channel temperature does not exceed 150 . Note 2: Device mounted on an FR4 board. (25.4 mm 25.4 mm 1.6 mm ,Cu pad: 645 mm2) Note: The MOSFETs in this device are sensitive to electrostatic discharge. When handling this device, the worktables, operators, soldering irons and other objects should be protected against anti-static discharge. Note: The channel-to-ambient thermal resistance, R , and the drain power dissipation, P , vary according to th(ch-a) D the board material, board area, board thickness and pad area. When using this device, be sure to take heat dissipation fully into account. 2016 Toshiba Corporation 2016-08-23 2 Rev.2.0