X-On Electronics has gained recognition as a prominent supplier of SSM3J56MFV,L3F MOSFETs across the USA, India, Europe, Australia, and various other global locations. SSM3J56MFV,L3F MOSFETs are a product manufactured by Toshiba. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

SSM3J56MFV,L3F Toshiba

SSM3J56MFV,L3F electronic component of Toshiba
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Part No.SSM3J56MFV,L3F
Manufacturer: Toshiba
Category: MOSFETs
Description: MOSFET Small Signal MOSFET
Datasheet: SSM3J56MFV,L3F Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
10: USD 0.0818 ea
Line Total: USD 0.82 
Availability - 5935
Ship by Fri. 22 Nov to Wed. 27 Nov
MOQ: 10  Multiples: 10
Pack Size: 10
Availability Price Quantity
6790
Ship by Fri. 15 Nov to Thu. 21 Nov
MOQ : 1
Multiples : 1
1 : USD 0.338
10 : USD 0.2249
25 : USD 0.2227
100 : USD 0.1295
250 : USD 0.1282
500 : USD 0.116
1000 : USD 0.0827
3000 : USD 0.0818
6000 : USD 0.0667

5935
Ship by Fri. 22 Nov to Wed. 27 Nov
MOQ : 10
Multiples : 10
10 : USD 0.0818
100 : USD 0.0657
300 : USD 0.0578
1000 : USD 0.052
5000 : USD 0.0447
8000 : USD 0.0424

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Series
Brand
Factory Pack Quantity :
Height
Length
Transistor Type
Width
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the SSM3J56MFV,L3F from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the SSM3J56MFV,L3F and other electronic components in the MOSFETs category and beyond.

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SSM3J56MFV TOSHIBA Field-Effect Transistor Silicon P-Channel MOS Type (U-MOS) SSM3J56MFV Load Switching Applications 1.2 V drive Unit: mm Low ON-resistance: R = 390 m (max) ( V = -4.5 V) DS(ON) GS R = 480 m (max) ( V = -2.5 V) DS(ON) GS R = 660 m (max) ( V = -1.8 V) DS(ON) GS R = 900 m (max) ( V = -1.5 V) DS(ON) GS R = 4000 m (max) ( V = -1.2 V) DS(ON) GS Absolute Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit Drain-Source voltage V -20 V DSS Gate-Source voltage V 8 V GSS DC I (Note 1) -800 D Drain current mA Pulse I (Note 1) -1600 DP P (Note 2) 150 D 1.Gate Power dissipation P (Note 3) 500 mW D 2.Source t < 5s 800 3.Drain Channel temperature T 150 C ch Storage temperature range T 55 to 150 C VESM stg JEDEC Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, JEITA etc.) may cause this product to decrease in the reliability significantly even TOSHIBA 2-1L1B if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Weight: 1.5mg (typ.) Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: The channel temperature should not exceed 150C during use. Note 2: Mounted on a FR4 board. 2 (25.4 mm 25.4 mm 1.6 mm, Cu Pad: 0.585 mm ) Note 3: Mounted on a FR4 board. 2 (25.4 mm 25.4 mm 1.6 mm, Cu Pad: 645 mm ) Marking Equivalent Circuit (top view) 3 3 PW 1 2 1 2 Handling Precaution When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that come into direct contact with devices should be made of antistatic materials. Thermal resistance R and Power dissipation P vary depending on board material, board area, board thickness th (ch-a) D and pad area. When using this device, please take heat dissipation into consideration. Start of commercial production 2011-05 1 2014-03-01 SSM3J56MFV Electrical Characteristics (Ta = 25C) Characteristic Symbol Test Conditions Min Typ. Max Unit V I = -1 mA, V = 0 V -20 V (BR) DSS D GS Drain-source breakdown voltage V I = -1 mA, V = 5 V .(Note 5) -15 V (BR) DSX D GS Drain cut-off current I V = -20 V, V = 0 V -1 A DSS DS GS Gate leakage current I V = 8 V, V = 0 V 1 A GSS GS DS Gate threshold voltage V V = -3 V, I = -1 mA -0.3 -1.0 V th DS D Forward transfer admittance Y V = -3 V, I = -100 mA (Note 4) 0.5 1.0 S fs DS D I = -800 mA, V = -4.5 V (Note 4) 310 390 D GS I = -500 mA, V = -2.5 V (Note 4) 380 480 D GS Drainsource ON-resistance R I = -200 mA, V = -1.8 V (Note 4) 470 660 m DS (ON) D GS I = -100 mA, V = -1.5 V (Note 4) 560 900 D GS I = -10 mA, V = -1.2 V (Note 4) 770 4000 D GS Input capacitance C 100 iss Output capacitance C V = -10 V, V = 0 V, f = 1 MHz 16 pF DS GS oss Reverse transfer capacitance C 10 rss Turn-on time t V = -10 V, I = -200 mA 8 on DD D Switching time ns Turn-off time t V = 0 to -2.5 V, R = 50 26 GS G off Total gate charge Q 1.6 g V = -10 V, I = -800 mA, DD D nC Gate-source charge Q 0.2 gs1 V = -4.5 V GS Gate-drain charge Q 0.4 gd Drain-source forward voltage V I = 800 mA, V = 0 V (Note 4) 0.9 1.2 V DSF D GS Note 4: Pulse test Note 5: If a forward bias is applied between gate and source, this device enters V(BR)DSX mode. Note that the drain-source breakdown voltage is lowered in this mode. Switching Time Test Circuit 0 V (a) Test Circuit (b) V 90% IN OUT 0 IN 10% 2.5 V 2.5V R L V DS (ON) 90% (c) V 10 s OUT V DD V = -10 V 10% DD V DD R = 50 G t t r f Duty 1% V : t , t < 5 ns IN r f t t on off Common Source Ta = 25C Notice on Usage V can be expressed as the voltage between gate and source when the low operating current value is I = -1 mA for th D this product. For normal switching operation, V requires a higher voltage than V and V requires a lower GS (on) th GS (off) voltage than V (The relationship can be established as follows: V < V < V ) th. GS (off) th GS (on). Take this into consideration when using the device. 2 2014-03-01 R G

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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