Product Information

TCR3DM30,LF(SE

TCR3DM30,LF(SE electronic component of Toshiba

Datasheet
LDO Voltage Regulators LDO Reg Iout: 300mA Vin: 6V Vout:2.85V

Manufacturer: Toshiba
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.6831 ea
Line Total: USD 0.68

38654 - Global Stock
Ships to you between
Fri. 31 May to Tue. 04 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
38115 - WHS 1


Ships to you between Fri. 31 May to Tue. 04 Jun

MOQ : 1
Multiples : 1
1 : USD 0.4711
10 : USD 0.318
100 : USD 0.1519
1000 : USD 0.121
2500 : USD 0.1056
10000 : USD 0.0961
20000 : USD 0.0961
50000 : USD 0.0878
100000 : USD 0.0842

     
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Output Voltage
Output Current
Number of Outputs
Polarity
Quiescent Current
Input Voltage MIN
Input Voltage MAX
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Maximum Operating Temperature
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Hts Code
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TCR3DM series TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic TCR3DM series 300 mA CMOS Low Dropout Regulator with inrush current protection circuit The TCR3DM series are CMOS general-purpose single-output voltage regulators with an on/off control input, featuring low dropout voltage, low output noise voltage and low inrush current. These voltage regulators are available in fixed output voltages between 1.0 V and 4.5 V and capable of driving up to 300 mA. They feature over-current protection, over-temperature protection, Inrush current protection circuit and Auto-discharge function. The TCR3DM series are offered in the ultra small plastic mold package DFN4/DFN4E (1.0 mm x 1.0 mm t 0.58 mm). It has a low dropout voltage of 210 mV (2.5 V output, I = 300 mA) with low output noise voltage of 38 OUT BOTTOM VIEW ILLUSTRATION Vrms (2.5 V output) and a load transient response of only V = 80 mV OUT DFN4/DFN4E ( I = 1 mA300 mA, C =1.0 F). OUT OUT As small ceramic input and output capacitors can be used with the Weight : 1.3 mg ( typ.) TCR3DM series, these devices are ideal for portable applications that require high-density board assembly such as cellular phones. Features Low Dropout voltage V = 210 mV (typ.) at 2.5 V-output, I = 300 mA DO OUT V = 270 mV (typ.) at 1.8 V-output, I = 300 mA DO OUT V = 490 mV (typ.) at 1.2 V-output, I = 300 mA DO OUT Low output noise voltage V = 38 V (typ.) at 2.5 V-output, I = 10 mA, 10 Hz f 100 kHz NO rms OUT Fast load transient response (V = 80 mV (typ.) at I = 1 mA 300 mA, C =1.0 F) OUT OUT OUT High ripple rejection (R.R = 70 dB (typ.) at 2.5 V-output, I = 10 mA, f =1 kHz) OUT Overcurrent protection Over-temperature protection Inrush current protection circuit Auto-discharge Pull down connection between CONTROL and GND Ceramic capacitors can be used (C = 1.0 F, C =1.0 F) IN OUT Ultra small package DFN4/DFN4E (1.0 mm x 1.0 mm t 0.58 mm) Start of commercial production 2013-03 2021 2021-09-27 1 Toshiba Electronic Devices & Storage Corporation TCR3DM series Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Input voltage V 6.0 V IN Control voltage V -0.3 to 6.0 V CT Output voltage V -0.3 to V + 0.3 V OUT IN Output current I 300 mA OUT Power dissipation P 420 (Note1) mW D Operating temperature range T -40 to 85 C opr Junction temperature T 150 C j Storage temperature range T -55 to 150 C stg Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note1: Rating at mounting on a board Glass epoxy(FR4) board dimension: 40mm x 40mm x 1.6mm, both sides of board. Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50% Through hole hall: diameter 0.5mm x 24 Pin Assignment (top view) V IN CONTROL 4 3 * 1 2 V OUT GND *Center electrode should be connected to GND or Open 2021 2021-09-27 2 Toshiba Electronic Devices & Storage Corporation

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Toshiba Memory
Toshiba Memory Corporation
Toshiba Semiconductor and Storage
TOSHIBA SEMICONDUCTORS
TS4

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