TLP2719 Photocouplers GaAAs Infrared LED & Photo IC TLP2719TLP2719TLP2719TLP2719 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Intelligent Power Module Signal Isolation Factory Automation (FA) Industrial Inverters 2. 2. 2. 2. GeneralGeneralGeneralGeneral The TLP2719 consists of a high-output GaAAs light-emitting diode coupled with a high-gain, high-speed photo detector. It is housed in the SO6L package. This product can be mounted on the same land-pattern as Toshiba s SDIP6 packages. In addition, the SO6L packages has a maximum height of 2.3 mm, which is approximately 45 % thinner than the conventional SDIP6 packages. Its low profile package contributes to system size reduction and can be placed in height-restricted locations, such as the back of a board. Also, since TLP2719 guarantees high Isolation Voltage of 5 kVrms (min), this product satisfies the reinforced insulation class according to international safety standards. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Inverter logic type (open collector output) (2) Package: SO6L (3) Operating temperature: -40 to 100 (4) Supply voltage: -0.5 to 30 V (5) Data transfer rate: 1 MBd (typ.) (NRZ) (6) Common-mode transient immunity: 10 kV/s (min) (7) Isolation voltage: 5000 Vrms (min) (8) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Pending) (Note 1)(Note 1)(Note 1) CQC-approved: GB4943.1, GB8898 Japan Factory (Pending) Option (D4)Option (D4) Note 1: When a VDE approved type is needed, please designate the Option (D4)Option (D4). Start of commercial production 2018-05 2018 2018-05-21 1 Toshiba Electronic Devices & Storage Corporation Rev.1.0TLP2719 4. 4. 4. 4. Packaging (Note)Packaging (Note)Packaging (Note)Packaging (Note) TLP2719 TLP2719(LF4) 11-4N1A 11-4N101A Note: Lead-formed product: (LF4) 5. Pin Assignment 5. 5. 5. Pin AssignmentPin AssignmentPin Assignment 1: Anode 2: N.C. 3: Cathode 4: GND 5: V (Output) O 6: V CC 6. 6. 6. 6. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 0.1-F bypass capacitor must be connected between pin 6 and pin 4. 2018 2018-05-21 2 Toshiba Electronic Devices & Storage Corporation Rev.1.0