TLP3021(S),TLP3022(S),TLP3023(S) TOSHIBA PHOTOCOUPLER IRED & PHOTO-TRIAC TLP3021(S),TLP3022(S),TLP3023(S) Unit: mm OFFICE MACHINE HOUSEHOLD USE EQUIPMENT TRIAC DRIVER SOLID STATE RELAY The TOSHIBA TLP3021 (S), TLP3022 (S) and TLP3023 (S) consist of photo-triac optically coupled to an infrared emitting diode in a six lead plastic DIP. Peak Off-State Voltage : 400 V (min) Trigger LED Current : 15 mA (max) (TLP3021(S)) 10 mA (max) (TLP3022(S)) 5 mA (max) (TLP3023(S)) On-State Current : 100 mA (max) JEDEC JEITA Isolation Voltage : 5000Vrms(Min) TOSHIBA 11-7A9S UL-recognized : UL 1577, File No.E67349 Weight: 0.39g (typ.) cUL-recognized : CSA Component Acceptance Service No.5A File No.E67349 VDE-approved : EN 60747-5-5 ,EN 62368-1 (Note 1) Pin Configuration Note 1 :When a VDE approved type is needed, (top view) please designate the Option (D4). 1 6 Construction Mechanical Rating 2 7.62 mm pitch 10.16 mm pitch Standard Type TLPxxxxF Type 4 3 Creepage Distance 7.0 mm (Min) 8.0 mm (Min) Clearance 7.0 mm (Min) 8.0 mm (Min) 1: Anode Insulation Thickness 0.5 mm (Min) 0.5 mm (Min) 2: Csthode 3: N.C. 4:Terminal 1 6:Terminal 2 Start of commercial production 1986-11 2019 1 2019-06-17 Toshiba Electronic Devices & Storage Corporation TLP3021(S),TLP3022(S),TLP3023(S) Absolute Maximum Ratings (Ta=25C) CHARACTERISTIC SYMBOL RATING UNIT Forward Current I 50 mA F Forward Current Derating (Ta53C) I /C 0.7 mA /C F Peak Forward Current (100s pulse, 100pps) IFP 1 A Reverse Voltage V 5 V R Power Dissipation P 100 mW D Power Dissipation Derating (Ta25C) P /C -1.0 mW/C D Junction Temperature Tj 125 C Off-State Output Terminal Voltage V 400 V DRM Ta=25C 100 On-State RMS Current I mA T(RMS) Ta=70C 50 On-State Current Derating (Ta25C) I /C -1.1 mA /C T Peak On-State Current (100s pulse, 120pps) I 2 A TP Peak Nonrepetitive Surge Current (Pw=10ms) ITSM 1.2 A mW Power Dissipation P 300 D mW/C Power Dissipation Derating (Ta25C) P /C -4.0 D C Junction Temperature T 115 j Storage Temperature Range T 55 to 150 C stg Operating Temperature Range T 40 to 100 C opr C Lead Soldering Temperature (10 s) T 260 sol mW Total Package Power Dissipation P 330 T Total Package Power Dissipation Derating (Ta25C) P /C -4.4 mW /C T Isolation Voltage (AC,60 s. , R.H. 60 %) (Note 2) BV 5000 Vrms S Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). (Note 2) Device considered a two terminal device :Pins1,2 and 3 shorted together and pin4 and pin6 shorted together. Recommended Operating Conditions CHARACTERISTIC SYMBOL MIN. TYP. MAX. UNIT Supply Voltage V 120 V AC ac * Forward Current I 15 20 25 mA F Peak On-State Current I 1 A TP Operating Temperature T 25 85 C opr Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document. *In The case of TLP3022 2019 2 2019-06-17 Toshiba Electronic Devices & Storage Corporation DETECTOR LED