CDHV 2512 Vishay Techno Thick Film Chip Dividers, High Voltage FEATURES High voltage up to 3000 V Typical resistance ratios of 250:1, 500:1, etc. Pb-free Flow solderable Available Tape and reel packaging available RoHS* Available with either wraparound terminations COMPLIANT or as a single termination flip chip Suitable for solderable, epoxy bondable, or wire bondable applications Termination: Gold, palladium silver, platinum gold, ELECTRICAL SPECIFICATIONS platinum silver, platinum palladium gold or solder-coated Resistance Range: 1 M to 20 G nickel barrier available Resistance Tolerance: 1 % to 20 % Multiple styles, termination materials and configurations, Power Rating: See table allow wide design flexibility Voltage Coefficient: See table Non-magnetic terminations available Lead (Pb)-free version is RoHS compliant Temperature Coefficient: See table Ratio Tracking: See table ENVIRONMENTAL SPECIFICATIONS Operating temperature: - 55 C to + 150 C MECHANICAL SPECIFICATIONS Construction: 96 % alumina substrate with proprietary Life: Less than 0.5 % change when tested at full rated power cermet resistance element and specified termination (Reference only: Not for all values specified. Consult factory for your material size and value.) STANDARD ELECTRICAL SPECIFICATIONS (1) RESISTANCE ( ) POWER RATING (mW) VOLTAGE RATING (V max.) 20M to 20G contact factory 3000 Note (1) Resistance values below 1 G are calibrated at 100 V , and values of 1 G and above are calibrated at 1000 V . Calibration at other DC DC voltages available upon request. VOLTAGE AND TEMPERATURE COEFFICIENTS OF RESISTANCE CHART TYPICAL RESISTANCE ( ) RATIO (typical) VCR (ppm/V) TCR (ppm/C) - 55 C to + 150 C 20M 250:1 5 260 150M 300:1 5 80 800M 300:1 10 50 20G 700:1 90 160 GLOBAL PART NUMBER INFORMATION New Global Part Numbering: CDHVAA20M0J2500GFB (preferred part number format) C DH VA A 2 0 M 0 J 250 0 G F B GLOBAL TERM RESISTANCE RATIO RATIO SOLDER TERM MATERIAL TOLERANCE PACKAGING MODEL STYLE VALUE (R1) R1/R2 TOLERANCE TERMINATION CDHV = A = 3-sided A = Palladium silver M = Million F = 1.0 % 3 digit F = 1.0 % E = Sn100 B = Bulk CDHV2512 B = top only B = Platinum gold G = Billion G = 2.0 % significant G = 2.0 % F = Sn95/Ag5 T = Tape and C = Gold 20M0 = 20 M H = 3.0 % figure, followed H = 3.0 % N = No solder reel D = Platinum silver 800M = 800 M J = 5.0 % by a multiplier J = 5.0 % S = W = Waffle E = Platinum 20G0 = 20 G K = 10.0 % 2500 = 250:1 Sn62/Pb36/Ag2 palladium gold M = 20.0 % 3000 = 300:1 T = Sn90/Pb10 F = Nickel barrier 7000 = 700:1 Historical Part Numbering: CDHV2512AA2005J2500Ge2 (will continue to be accepted) CDHV2512 A A 2005 J 2500 G e2 HISTORICAL TERM TERM RESISTANCE RATIO RATIO SOLDER TOLERANCE MODEL STYLE MATERIAL VALUE (R1) R1/R2 TOLERANCE TERMINATION * Pb containing terminations are not RoHS compliant, exemptions may apply Document Number: 68020 For technical questions, contact: te1resistors vishay.com www.vishay.com Revision: 19-Nov-08 5CDHV 2512 Thick Film Chip Dividers, High Voltage Vishay Techno RATIO TRACKING (ppm/C) RESISTANCE () RATIO (typical) COLD (+ 25 C to - 50 C) HOT (+ 25 C to + 150 C) 20M 250:1 5 260 150M 300:1 5 80 800M 300:1 10 50 20G 700:1 90 160 Note Contact factory for other ratios DIMENSIONS in inches millimeters B B L A A C C T T W B B W A A Style B Style A B C A E W Style A Bottom (3-sided wraparound) LENGTH (L) WIDTH (W) THICKNESS (T) TERMINATION A 0.005 B 0.005 C 0.005 E 0.005 0.006 0.152 0.006 0.152 0.002 0.051 STYLE A 0.250 0.126 0.025 0.025 0.025 0.040 0.046 (wraparound 3 sided) STYLE B 0.240 0.126 0.025 0.025 0.025 0.040 - (top only) DERATING CURVE 120 100 80 60 40 20 0 20 50 70 100 150 AMBIENT TEMPERATURE IN C (Reference only: Not for all values specified. Consult factory for your size and value.) www.vishay.com For technical questions, contact: te1resistors vishay.com Document Number: 68020 6 Revision: 19-Nov-08 % OF RA TED POWER