DFN (Divider) www.vishay.com Vishay Dale Thin Film Dual Flat No Lead Molded Precision Thin Film Divider, Surface Mount Resistor Network FEATURES 0.8 mm lead pitch MSL level 1 per J-STD-020 Low profile 1 mm seated height Small size 4 mm x 4 mm size 50 % board savings over SOIC packages Low TCR 25 ppm, TCR tracking to 5 ppm Compliant to RoHS Directive 2002/95/EC The DFN series of thin film precision dividers surface mount resistor networks offer a wide ratio range that is listed in the TYPICAL PERFORMANCE standard resistance offering table. The 4 mm x 4 mm 0.8 mm pitch dual flat no lead package feature 50 % savings ABSOLUTE TRACKING in board space over traditional SOIC packages. The DFN TCR 25 5 dividers are ideal for applications that require tight TC ABSOLUTE RATIO tracking and ratio tolerances over temperature. TOL. 0.1 0.05 SCHEMATIC STANDARD RESISTANCE OFFERING (R /R ) 1 2 8 76 5 RATIO R R 1 2 100:1 100K 1K 50:1 50K 1K R R R R 1 2 2 1 25:1 25K 1K 20:1 20K 1K 10:1 10K 1K 123 4 5:1 10K 2K 2:1 10K 5K STANDARD ELECTRICAL SPECIFICATIONS TEST SPECIFICATIONS CONDITIONS Material Passivated nichrome - Pin/Lead Number 8- Resistance Range 1000 to 100 k per element - TCR: Absolute 25 ppm/C - 55 C to + 125 C TCR: Tracking 5 ppm/C - 55 C to + 125 C Tolerance: Absolute 0.1 % + 25 C Tolerance: Ratio 0.05 % + 25 C Power Rating: Resistor 100 mW Maximum at + 70 C Power Rating: Package 100 mW x number of resistors Maximum at + 70 C Stability: Absolute R 0.05 % 2000 h at + 70 C Stability: Ratio R 0.015 % 2000 h at + 70 C Voltage Coefficient < 0.1 ppm/V - Working Voltage 100 V max. not to exceed P x R - Operating Temperature Range - 55 C to + 125 C - Storage Temperature Range - 55 C to + 150 C - Noise < - 30 dB - Thermal EMF < 0.08 V/C - Shelf Life Stability: Absolute R 0.01 % 1 year at + 25 C Shelf Life Stability: Ratio R 0.002 % 1 year at + 25 C Revision: 01-Sep-11 Document Number: 60110 1 For technical questions, contact: thinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 DFN (Divider) www.vishay.com Vishay Dale Thin Film DIMENSIONS AND IMPRINTING in millimeters 3.500 0.050 4.000 0.050 Exposed Pad 85 0.300 0.050 0.800 BSC (1) Part Number 5 6 7 to be 4 Characters DFNA 2.700 0.050 4.000 0.050 xxxx Exposed Pad MMYY 4 3 2 1 Date Pin 1 Indentification 14 2.400 Pin 1 Dot Code 0.400 0.050 Ref. Chamfer 0.300 x 45 by Marking (MMYY) (4 mm x 4 mm) BOTTOM VIEW TOP VIEW A Max. 0.900 A Nom. 0.850 0.000 - 0.050 0.203 Ref. Min. 0.800 SIDE VIEW Notes (1) 100-1 resistance ratio part marking to be 100- (2) Contact factory for package outlines for higher pin count or custom configurations MECHANICAL SPECIFICATIONS Resistive Element Passivated nichrome Substrate Material Silicon Body Molded epoxy Terminals Copper alloy Plating 100 % matte tin Marking Resistance to Solvents Per MIL-PRF-914 GLOBAL PART NUMBER INFORMATION D F N A5 - 1 U F GLOBAL MODEL RESISTANCE PACKAGING (4 digits) (3, 4 or 5 digits) DFNA 2-1 TAPE AND REEL (Lead (Pb)-free) 5-1 T0 = 100 min., 100 mult (3) (e3) 10-1 T1 = 1000 min., 1000 mult 20-1 T3 = 300 min., 300 mult 25-1 T5 = 500 min., 500 mult 50-1 TF = Full reel 3000 100-1 TS = 100 min., 1 mult UF = TUBED Note (3) Preferred packaging code Revision: 01-Sep-11 Document Number: 60110 2 For technical questions, contact: thinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 8