X-On Electronics has gained recognition as a prominent supplier of W25M02GVTCIT Multichip Packages across the USA, India, Europe, Australia, and various other global locations. W25M02GVTCIT Multichip Packages are a product manufactured by Winbond. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

W25M02GVTCIT Winbond

W25M02GVTCIT electronic component of Winbond
Product Image X-ON
Product Image X-ON
Product Image X-ON

Images are for reference only
See Product Specifications
Part No.W25M02GVTCIT
Manufacturer: Winbond
Category: Multichip Packages
Description: Multichip Packages 2G-bit Serial NAND flash, 3V
Datasheet: W25M02GVTCIT Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
480: USD 4.95 ea
Line Total: USD 2376 
Availability - 0
MOQ: 480  Multiples: 480
Pack Size: 480
Availability Price Quantity
0
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 480
Multiples : 480
480 : USD 4.95
960 : USD 4.741
2880 : USD 4.598
5280 : USD 4.532
10080 : USD 4.411

   
Manufacturer
Product Category
Type
Memory Size
Package / Case
Series
Mounting Style
Maximum Clock Frequency
Minimum Operating Temperature
Maximum Operating Temperature
Hts Code
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the W25M02GVTCIT from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25M02GVTCIT and other electronic components in the Multichip Packages category and beyond.

Image Part-Description
Stock Image W9712G6KB25I
DRAM Chip DDR2 SDRAM 128Mbit 8Mx16 1.8V 84-Pin TFBGA
Stock : 255
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Hot Stock Image W9825G6KH-6
IC SDRAM 256MBIT 166MHZ 54TSOP
Stock : 429
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9712G6KB-25
DRAM Chip DDR2 SDRAM 128Mbit 8Mx16 1.8V 84-Pin TFBGA
Stock : 109
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Hot Stock Image W9425G6KH-5
4 M X 4 BANKS X16 BITS DDR SDRAM
Stock : 19
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9412G6KH-5I
DRAM Chip DDR SDRAM 128Mbit 8Mx16 2.5V 66-Pin TSOP-II
Stock : 8
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Hot Stock Image W9412G6KH-5
DRAM Chip DDR SDRAM 128Mbit 8Mx16 2.5V 66-Pin TSOP-II
Stock : 1720
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Hot Stock Image W9864G6KH-6
DRAM Chip SDRAM 64Mbit 4Mx16 3.3V 54-Pin TSOP-II
Stock : 1070
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9816G6JH-7
DRAM 16M SDR SDRAM 133MHz
Stock : 685
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W956D8MBKX5I
DRAM 64Mb HyperRAM x8 200MHz Ind temp 1.8V
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9751G8NB-25
DRAM 512Mb DDR2-800, x8
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Image Part-Description
Stock Image S71VS128RC0AHK4L0
Multichip Packages Nor
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image S71VS064RB0AHT4L0
Multichip Packages Nor
Stock : 346
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image S71VS128RB0AHK4L0
Multichip Packages Nor
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT29RZ2B2DZZHHTB-18I.88F TR
Multichip Packages MASSFLASH/LPDDR2 4G
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT29C1G12MAAJVAMD-5 IT TR
Multichip Packages MASSFLASH/MOBILE DDR 1.5G
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT29RZ2B1DZZHGWD-18I.83G TR
Multichip Packages MASSFLASH/LPDDR2 3G
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W25M512JVEIQ
Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector
Stock : 120
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W25M02GWZEIG
Multichip Packages 2G-bit Serial NAND flash, 1.8V
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W25M161AVEIT
Multichip Packages 1Gb Serial NAND flash 3V + 16Mb Serial Flash 3V MCP
Stock : 3968
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W25M512JVEIQ TR
Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector
Stock : 4217
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

W25M02GV Featuring 3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS Publication Release Date: May 17, 2021 Revision I W25M02GV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 6 2. FEATURES ....................................................................................................................................... 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 7 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 7 3.2 Pad Description WSON 8x6-mm .......................................................................................... 7 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 8 3.4 Pin Description SOIC 300-mil ............................................................................................... 8 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 9 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 9 4. PIN DESCRIPTIONS ...................................................................................................................... 10 4.1 Serial MCP (SpiStack ) Device Configuration ................................................................... 10 4.2 Chip Select (/CS) ................................................................................................................ 10 4.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................. 10 4.4 Write Protect (/WP) ............................................................................................................. 11 4.5 HOLD (/HOLD) ................................................................................................................... 11 4.6 Serial Clock (CLK) .............................................................................................................. 11 5. SINGLE DIE (W25N01GV) BLOCK DIAGRAM .............................................................................. 12 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 13 6.1 Device Operation Flow ....................................................................................................... 13 6.1.1 Stacked Die Operations ........................................................................................................ 13 6.1.2 Standard SPI Instructions ..................................................................................................... 13 6.1.3 Dual SPI Instructions ............................................................................................................ 14 6.1.4 Quad SPI Instructions ........................................................................................................... 14 6.1.5 Hold Function ........................................................................................................................ 14 6.2 Write Protection .................................................................................................................. 15 7. PROTECTION, CONFIGURATION AND STATUS REGISTERS .................................................. 16 7.1 Protection Register / Status Register-1 (Volatile Writable, OTP lockable) ......................... 16 7.1.1 Block Protect Bits (BP3, BP2, BP1, BP0, TB) Volatile Writable, OTP lockable .................. 16 7.1.2 Write Protection Enable Bit (WP-E) Volatile Writable, OTP lockable ................................. 17 7.1.3 Status Register Protect Bits (SRP1, SRP0) Volatile Writable, OTP lockable ..................... 17 7.2 Configuration Register / Status Register-2 (Volatile Writable) ........................................... 18 7.2.1 One Time Program Lock Bit (OTP-L) OTP lockable .......................................................... 18 7.2.2 Enter OTP Access Mode Bit (OTP-E) Volatile Writable ..................................................... 18 7.2.3 Status Register-1 Lock Bit (SR1-L) OTP lockable ............................................................. 18 7.2.4 ECC Enable Bit (ECC-E) Volatile Writable ......................................................................... 19 7.2.5 Buffer Read / Continuous Read Mode Bit (BUF) Volatile Writable ..................................... 20 7.3 Status Register-3 (Status Only) .......................................................................................... 21 7.3.1 Look-Up Table Full (LUT-F) Status Only ............................................................................ 21 7.3.2 Cumulative ECC Status (ECC-1, ECC-0) Status Only ....................................................... 21 7.3.3 Program Failure (P-FAIL) Status Only ............................................................................... 22 7.3.4 Erase Failure (E-FAIL) Status Only ................................................................................... 22 7.3.5 Write Enable Latch (WEL) Status Only .............................................................................. 22 - 1 -

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
254H-03 Headers & Wire Housings by Itek in India, USA image

Nov 19, 2024
The 254H-03 Headers & Wire Housings by Itek are reliable 3-way connectors with a 2.54mm pitch, perfect for creating secure electrical connections in various applications. Manufactured for industries worldwide, including the USA, India, Australia, and Europe, this component ensures efficient power d
Comprehensive Guide to the GS9238-ATQ-R Datasheet by Xonelec image

Jul 4, 2024

Are you curious about the GS9238-ATQ-R datasheet by Xonelec and what it entails? You're in the right place! This article will take you on a journey through the intricate detail

What is Car Audio? its Applications and Benefits image

Aug 30, 2024
Discover the comprehensive guide to car audio accessories, covering everything from acoustic enhancements to professional-grade components. Explore categories like AUX adapters, GPS and GSM antennas, hands-free kit cables, park sensors, and more. Whether you're upgrading your sound system or enhanc
The Ultimate Guide to the CS3817BEO Datasheet by Xonelec image

Jul 5, 2024

Are you diving into the world of electronics and components? If so, you might have come across the CS3817BEO datasheet by Xonelec. This document is a treasure trove of information, but it can

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON Electronics
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronics Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing. All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted AS9120 Certified