X-On Electronics has gained recognition as a prominent supplier of W25M02GWZEIG TR Multichip Packages across the USA, India, Europe, Australia, and various other global locations. W25M02GWZEIG TR Multichip Packages are a product manufactured by Winbond. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

W25M02GWZEIG TR Winbond

W25M02GWZEIG TR electronic component of Winbond
Product Image X-ON
Product Image X-ON
Product Image X-ON

Images are for reference only
See Product Specifications
Part No.W25M02GWZEIG TR
Manufacturer: Winbond
Category: Multichip Packages
Description: Multichip Packages 2G-bit Serial NAND flash, 1.8V
Datasheet: W25M02GWZEIG TR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
4000: USD 4.433 ea
Line Total: USD 17732 
Availability - 0
MOQ: 4000  Multiples: 4000
Pack Size: 4000
Availability Price Quantity
0
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 4000
Multiples : 4000
4000 : USD 4.433

   
Manufacturer
Product Category
Type
Memory Size
Package / Case
Series
Mounting Style
Maximum Clock Frequency
Minimum Operating Temperature
Maximum Operating Temperature
Hts Code
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the W25M02GWZEIG TR from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25M02GWZEIG TR and other electronic components in the Multichip Packages category and beyond.

Image Part-Description
Stock Image W9712G6KB25I
DRAM Chip DDR2 SDRAM 128Mbit 8Mx16 1.8V 84-Pin TFBGA
Stock : 255
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Hot Stock Image W9825G6KH-6
IC SDRAM 256MBIT 166MHZ 54TSOP
Stock : 429
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9712G6KB-25
DRAM Chip DDR2 SDRAM 128Mbit 8Mx16 1.8V 84-Pin TFBGA
Stock : 109
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Hot Stock Image W9425G6KH-5
4 M X 4 BANKS X16 BITS DDR SDRAM
Stock : 19
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9412G6KH-5I
DRAM Chip DDR SDRAM 128Mbit 8Mx16 2.5V 66-Pin TSOP-II
Stock : 8
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Hot Stock Image W9412G6KH-5
DRAM Chip DDR SDRAM 128Mbit 8Mx16 2.5V 66-Pin TSOP-II
Stock : 1720
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Hot Stock Image W9864G6KH-6
DRAM Chip SDRAM 64Mbit 4Mx16 3.3V 54-Pin TSOP-II
Stock : 1190
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9816G6JH-7
DRAM 16M SDR SDRAM 133MHz
Stock : 685
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W956D8MBKX5I
DRAM 64Mb HyperRAM x8 200MHz Ind temp 1.8V
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9751G8NB-25
DRAM 512Mb DDR2-800, x8
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Image Part-Description
Stock Image S71VS128RC0AHK4L0
Multichip Packages Nor
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image S71VS064RB0AHT4L0
Multichip Packages Nor
Stock : 346
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image S71VS128RB0AHK4L0
Multichip Packages Nor
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT29RZ2B2DZZHHTB-18I.88F TR
Multichip Packages MASSFLASH/LPDDR2 4G
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT29C1G12MAAJVAMD-5 IT TR
Multichip Packages MASSFLASH/MOBILE DDR 1.5G
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image MT29RZ2B1DZZHGWD-18I.83G TR
Multichip Packages MASSFLASH/LPDDR2 3G
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W25M512JVEIQ
Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector
Stock : 120
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W25M02GWZEIG
Multichip Packages 2G-bit Serial NAND flash, 1.8V
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W25M161AVEIT
Multichip Packages 1Gb Serial NAND flash 3V + 16Mb Serial Flash 3V MCP
Stock : 3968
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W25M512JVEIQ TR
Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector
Stock : 4217
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

W25M02GW Featuring 1.8V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS Publication Release Date: January 22, 2019 Revision D W25M02GW Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 6 2. FEATURES ....................................................................................................................................... 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 7 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 7 3.2 Pad Description WSON 8x6-mm .......................................................................................... 7 3.3 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.4 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Serial MCP (SpiStack ) Device Configuration ..................................................................... 9 4.2 Chip Select (/CS) .................................................................................................................. 9 4.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9 4.4 Write Protect (/WP) ............................................................................................................... 9 4.5 HOLD (/HOLD) ................................................................................................................... 10 4.6 Serial Clock (CLK) .............................................................................................................. 10 5. SINGLE DIE (W25N01GW) BLOCK DIAGRAM ............................................................................. 11 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12 6.1 Device Operation Flow ....................................................................................................... 12 6.1.1 Stacked Die Operations ........................................................................................................ 12 6.1.2 Standard SPI Instructions ..................................................................................................... 12 6.1.3 Dual SPI Instructions ............................................................................................................ 13 6.1.4 Quad SPI Instructions ........................................................................................................... 13 6.1.5 Hold Function ........................................................................................................................ 13 6.2 Write Protection .................................................................................................................. 14 7. PROTECTION, CONFIGURATION AND STATUS REGISTERS .................................................. 15 7.1 Protection Register / Status Register-1 (Volatile Writable, OTP lockable) ......................... 15 7.1.1 Block Protect Bits (BP3, BP2, BP1, BP0, TB) Volatile Writable, OTP lockable .................. 15 7.1.2 Write Protection Enable Bit (WP-E) Volatile Writable, OTP lockable ................................. 16 7.1.3 Status Register Protect Bits (SRP1, SRP0) Volatile Writable, OTP lockable ..................... 16 7.2 Configuration Register / Status Register-2 (Volatile Writable) ........................................... 17 7.2.1 One Time Program Lock Bit (OTP-L) OTP lockable .......................................................... 17 7.2.2 Enter OTP Access Mode Bit (OTP-E) Volatile Writable ..................................................... 17 7.2.3 Status Register-1 Lock Bit (SR1-L) OTP lockable ............................................................. 17 7.2.4 ECC Enable Bit (ECC-E) Volatile Writable ......................................................................... 17 7.2.5 Buffer Read / Continuous Read Mode Bit (BUF) Volatile Writable ..................................... 18 7.3 Status Register-3 (Status Only) .......................................................................................... 19 7.3.1 Look-Up Table Full (LUT-F) Status Only ............................................................................ 19 7.3.2 Cumulative ECC Status (ECC-1, ECC-0) Status Only ....................................................... 19 7.3.3 Program/Erase Failure (P-FAIL, E-FAIL) Status Only ........................................................ 20 7.3.4 Write Enable Latch (WEL) Status Only .............................................................................. 20 7.3.5 Erase/Program In Progress (BUSY) Status Only ............................................................... 20 7.3.6 Reserved Bits Non Functional ........................................................................................... 20 7.4 Single Die W25N01GW Status Register Memory Protection ............................................. 21 8. INSTRUCTIONS ............................................................................................................................. 22 - 1 -

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
Revolutionizing Electronic Components Online Shopping Worldwide image

Aug 22, 2024
Discover X-On Electronic Pvt Ltd, a global leader in electronic components online shopping. Offering a vast selection of passive electronic components, basic components, DC-DC isolated converters, audio amplifier ICs, and more, X-On ensures high-quality products at competitive prices. With a user-f
What is Circular MIL Spec Backshells image

Aug 29, 2024
Circular MIL Spec Backshells are essential components used in aerospace, military, industrial, and marine applications to protect electrical connections from environmental factors. Made from durable materials like aluminum and stainless steel, they provide strain relief, durability, and environment
Difference Between Fuses and Breakers: A Comprehensive Guide image

Aug 13, 2024
Discover the key differences between fuses and circuit breakers in this comprehensive guide. Learn about their types, working principles, advantages, and disadvantages. Understand how to choose the right overcurrent protection device for your needs, whether for residential, commercial, or industria
Best Retailer of Molex 39-01-2025 Headers & Wire Housings image

Aug 21, 2024
Discover why Xon Electronic is the best global retailer for the Molex 39-01-2025 Headers & Wire Housings, a 2 Circuit Receptacle Housing known for its reliability and durability. With a vast inventory, competitive pricing, and unparalleled technical support, Xon Electronic ensures timely delivery a

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON Electronics
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronics Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing. All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted AS9120 Certified