X-On Electronics has gained recognition as a prominent supplier of W25M121AVEIT TR Multichip Packages across the USA, India, Europe, Australia, and various other global locations. W25M121AVEIT TR Multichip Packages are a product manufactured by Winbond. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

W25M121AVEIT TR Winbond

Name: W25M121AVEIT TR
Brand: Winbond
SKU: W25M121AVEITTR_Winbond
Availability: OutOfStock
Rating: 5 (11 reviews)

W25M121AVEIT TR electronic component of Winbond

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Part No.	W25M121AVEIT TR
Manufacturer:	Winbond
Category:	Multichip Packages
Description:	Multichip Packages 1Gb Serial NAND flash 3V + 128Mb Serial Flash 3V MCP
Datasheet:	W25M121AVEIT TR Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

N/A

Obsolete

W25M121AVEIT TR More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 MOQ : 4000 Multiples : 4000	4000 : USD 4.2901		N/A Obsolete

We are delighted to provide the W25M121AVEIT TR from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25M121AVEIT TR and other electronic components in the Multichip Packages category and beyond.

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Additional Infomation About Product

W25M121AV Featuring SERIAL MCP FLASH MEMORY With Multi I/O SPI & Concurrent Operations 3V 128M-bit Serial NOR Flash Memory & 3V 1G-bit Serial NAND Flash Memory Publication Release Date: August 21, 2017 Preliminary Revision A W25M121AV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 2 2. FEATURES ....................................................................................................................................... 3 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 4 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 4 3.2 Pad Description WSON 8x6-mm .......................................................................................... 4 4. DEVICE CONFIGURATION & PIN DESCRIPTIONS ....................................................................... 5 4.1 Serial MCP (SpiStack ) Device Configuration ..................................................................... 5 4.2 Chip Select (/CS) .................................................................................................................. 5 4.3 Serial Input & Output (DI, DO and IO0, IO1, IO2, IO3) ........................................................ 5 4.4 Serial Clock (CLK) ................................................................................................................ 6 5. CONCURRENT OPERATION DESCRIPTIONS .............................................................................. 6 6. SOFTWARE DIE SELECT (C2H) INSTRUCTION ........................................................................... 7 7. SOFTWARE RESET ........................................................................................................................ 8 7.1.1 Enable Reset (66h) and Reset Device (99h) .......................................................................... 9 7.1.2 Device Reset (FFh) ................................................................................................................. 9 8. PACKAGE SPECIFICATIONS ....................................................................................................... 10 8.1 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 10 9. ORDERING INFORMATION .......................................................................................................... 11 9.1 Valid Part Numbers and Top Side Marking ........................................................................ 12 10. REVISION HISTORY ...................................................................................................................... 13 - 1 -

HS Compliance

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

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Manufacturer Winbond Winbond
Product Category Multichip Packages Multichip Packages
Type NAND Flash, NOR Flash NAND Flash, NOR Flash
Memory Size 128 Mbit , 1 Gbit 128 Mbit , 1 Gbit
Package / Case WSON - 8 WSON - 8
Series W25M121AV W25M121AV
Mounting Style SMD/SMT SMD/SMT
Maximum Clock Frequency 133 MHz 133 MHz
Minimum Operating Temperature - 40 C - 40 C
Maximum Operating Temperature + 85 C + 85 C
Hts Code 8542320051 8542320051