X-On Electronics has gained recognition as a prominent supplier of W25M321AVEIT Multichip Packages across the USA, India, Europe, Australia, and various other global locations. W25M321AVEIT Multichip Packages are a product manufactured by Winbond. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

W25M321AVEIT Winbond

Name: W25M321AVEIT
Brand: Winbond
SKU: W25M321AVEIT_Winbond
Availability: OutOfStock
Rating: 5 (11 reviews)

W25M321AVEIT electronic component of Winbond

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Part No.	W25M321AVEIT
Manufacturer:	Winbond
Category:	Multichip Packages
Description:	Multichip Packages 1Gb Serial NAND flash 3V + 32Mb Serial Flash 3V MCP
Datasheet:	W25M321AVEIT Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

N/A

Obsolete

W25M321AVEIT More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 MOQ : 1 Multiples : 1	1 : USD 6.9972 10 : USD 4.9996 25 : USD 4.9507 100 : USD 4.3136 189 : USD 4.1373 1134 : USD 4.0668 2646 : USD 4.0433 5103 : USD 3.9375		N/A Obsolete

We are delighted to provide the W25M321AVEIT from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25M321AVEIT and other electronic components in the Multichip Packages category and beyond.

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Additional Infomation About Product

W25M321AV Featuring SERIAL MCP FLASH MEMORY With Multi I/O SPI & Concurrent Operations 3V 32M-bit Serial NOR Flash Memory & 3V 1G-bit Serial NAND Flash Memory Publication Release Date: December 13,, 2016 Preliminary Revision A W25M321AV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 2 2. FEATURES ....................................................................................................................................... 3 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 4 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 4 3.2 Pad Description WSON 8x6-mm .......................................................................................... 4 4. DEVICE CONFIGURATION & PIN DESCRIPTIONS ....................................................................... 5 4.1 Serial MCP (SpiStack ) Device Configuration ..................................................................... 5 4.2 Chip Select (/CS) .................................................................................................................. 5 4.3 Serial Input & Output (DI, DO and IO0, IO1, IO2, IO3) ........................................................ 5 4.4 Serial Clock (CLK) ................................................................................................................ 6 5. CONCURRENT OPERATION DESCRIPTIONS .............................................................................. 6 6. SOFTWARE DIE SELECT (C2H) INSTRUCTION ........................................................................... 7 7. SOFTWARE RESET......................................................................................................................... 8 7.1.1 Enable Reset (66h) and Reset Device (99h) .......................................................................... 9 7.1.2 Device Reset (FFh) ................................................................................................................. 9 8. PACKAGE SPECIFICATIONS ....................................................................................................... 10 8.1 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 10 9. ORDERING INFORMATION .......................................................................................................... 11 9.1 Valid Part Numbers and Top Side Marking ........................................................................ 12 10. REVISION HISTORY ...................................................................................................................... 13 - 1 -

HS Compliance

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

Winbond Elec may also be referenced as

WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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Manufacturer Winbond Winbond
Product Category Multichip Packages Multichip Packages
Type NAND Flash, NOR Flash NAND Flash, NOR Flash
Memory Size 32 Mbit , 1 Gbit 32 Mbit , 1 Gbit
Package / Case WSON - 8 WSON - 8
Series W25M321AV W25M321AV
Mounting Style SMD/SMT SMD/SMT
Maximum Clock Frequency 133 MHz 133 MHz
Minimum Operating Temperature - 40 C - 40 C
Maximum Operating Temperature + 85 C + 85 C
Hts Code 8542320051 8542320051