X-On Electronics has gained recognition as a prominent supplier of W25M512JVCIQ Multichip Packages across the USA, India, Europe, Australia, and various other global locations. W25M512JVCIQ Multichip Packages are a product manufactured by Winbond. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

W25M512JVCIQ Winbond

Name: W25M512JVCIQ
Brand: Winbond
SKU: W25M512JVCIQ_Winbond
Availability: OutOfStock
Rating: 5 (11 reviews)

W25M512JVCIQ electronic component of Winbond

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Part No.	W25M512JVCIQ
Manufacturer:	Winbond
Category:	Multichip Packages
Description:	Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector
Datasheet:	W25M512JVCIQ Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

480: USD 5.456 ea
Line Total: USD 2618.88

Availability - 0

MOQ: 480 Multiples: 480
Pack Size: 480

W25M512JVCIQ More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 Ship by Tue. 26 Nov to Thu. 28 Nov MOQ : 480 Multiples : 480	480 : USD 5.456

We are delighted to provide the W25M512JVCIQ from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25M512JVCIQ and other electronic components in the Multichip Packages category and beyond.

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Additional Infomation About Product

W25M512JV Featuring 3V 512M-BIT (2 x 256M-BIT) SERIAL MCP FLASH MEMORY With Multi I/O SPI & Concurrent Operations Publication Release Date: September 06, 2017 - Revision D W25M512JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 6 2. FEATURES ....................................................................................................................................... 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 7 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 7 3.2 Pad Description WSON 8x6-mm .......................................................................................... 7 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 8 3.4 Pin Description SOIC 300-mil ............................................................................................... 8 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 9 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 9 4. DEVICE CONFIGURATION & PIN DESCRIPTIONS ..................................................................... 10 4.1 Serial MCP (SpiStack ) Device Configuration ................................................................... 10 4.2 Chip Select (/CS) ................................................................................................................ 10 4.3 Serial Input & Output (DI, DO and IO0, IO1, IO2, IO3) ...................................................... 10 4.4 Serial Clock (CLK) .............................................................................................................. 10 4.5 Reset (/RESET) .................................................................................................................. 10 5. SINGLE DIE (W25Q256JV) BLOCK DIAGRAM ............................................................................. 11 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12 6.1 Device Operations .............................................................................................................. 12 6.1.1 Stacked Die Operations ........................................................................................................ 12 6.1.2 Standard SPI Instructions ..................................................................................................... 12 6.1.3 Dual & Quad SPI Instructions ............................................................................................... 13 6.1.4 3-Byte / 4-Byte Address Modes ............................................................................................ 13 6.1.5 Software Reset & Hardware /RESET pin .............................................................................. 13 6.2 Write Protection .................................................................................................................. 14 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 15 7.1 Status Registers ................................................................................................................. 15 7.1.1 Program/Erase/Write In Progress (BUSY) Status Only .................................................. 15 7.1.2 Write Enable Latch (WEL) Status Only ........................................................................... 15 7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) Volatile/Non-Volatile Writable ........................ 16 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ........................................ 16 7.1.5 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 16 7.1.6 Status Register Lock (SRL) Volatile/Non-Volatile OTP Writable ..................................... 16 7.1.7 Erase/Program Suspend Status (SUS) Status Only ....................................................... 17 7.1.8 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable ........... 17 7.1.9 Current Address Mode (ADS) Status Only ..................................................................... 17 7.1.10 Power-Up Address Mode (ADP) Non-Volatile Writable ................................................ 17 7.1.11 Write Protect Selection (WPS) Volatile/Non-Volatile Writable ...................................... 17 7.1.12 Output Driver Strength (DRV1, DRV0) Volatile/Non-Volatile Writable .......................... 18 7.1.13 Reserved Bits Non Functional ...................................................................................... 18 7.1.14 Single Die W25Q256JV Status Register Memory Protection (WPS = 0, CMP = 0) ............ 19 7.1.15 Single Die W25Q256JV Status Register Memory Protection (WPS = 0, CMP = 1) ............ 20 - 1 -

HS Compliance

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

Winbond Elec may also be referenced as

WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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Manufacturer Winbond Winbond
Product Category Multichip Packages Multichip Packages
Type Serial NOR Flash Serial NOR Flash
Memory Size 512 Mbit 512 Mbit
Package / Case TFBGA - 24 TFBGA - 24
Series W25M512JV W25M512JV
Mounting Style SMD/SMT SMD/SMT
Maximum Clock Frequency 104 MHz 104 MHz
Minimum Operating Temperature - 40 C - 40 C
Maximum Operating Temperature + 85 C + 85 C
Hts Code 8542320051 8542320051