X-On Electronics has gained recognition as a prominent supplier of W25N02JWSFIF NAND Flash across the USA, India, Europe, Australia, and various other global locations. W25N02JWSFIF NAND Flash are a product manufactured by Winbond. We provide cost-effective solutions for NAND Flash, ensuring timely deliveries around the world.

W25N02JWSFIF Winbond

W25N02JWSFIF electronic component of Winbond
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See Product Specifications
Part No.W25N02JWSFIF
Manufacturer: Winbond
Category: NAND Flash
Description: NAND Flash 2G-bit Serial NAND flash 1.8V
Datasheet: W25N02JWSFIF Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
176: USD 4.917 ea
Line Total: USD 865.39 
Availability - 0
MOQ: 176  Multiples: 176
Pack Size: 176
Availability Price Quantity
0
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 176
Multiples : 176
176 : USD 4.917
528 : USD 4.763
1056 : USD 4.653
2640 : USD 4.642
5104 : USD 4.455
10032 : USD 4.4

   
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the W25N02JWSFIF from our NAND Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25N02JWSFIF and other electronic components in the NAND Flash category and beyond.

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W25N02JWxxIF/IC 1.8V 2G-BIT SERIAL SLC NAND FLASH MEMORY DUAL/QUAD SPI WITH 166MHZ STR & 80MHZ DTR BUFFER READ & CONTINUOUS READ th Release Date: November 18 , 2019 Revision A W25N02JWxxIF/IC Table of Contents 1. GENERAL DESCRIPTIONS ....................................................................................................... 6 2. FEATURES ................................................................................................................................. 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .................................................................... 7 3.1 Pad Configuration WSON 8x6-mm ................................................................................ 7 3.2 Pad Description WSON 8x6-mm .................................................................................... 7 3.3 Pin Configuration SOIC 300-mil ..................................................................................... 8 3.4 Pin Description SOIC 300-mil ......................................................................................... 8 3.5 Ball Configuration TFBGA 8x6-mm (5x5-1 Ball Array) ................................................... 9 3.6 Ball Description TFBGA 8x6-mm ................................................................................... 9 4. PIN DESCRIPTIONS ................................................................................................................ 10 4.1 Chip Select (/CS) .......................................................................................................... 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ............................ 10 4.3 Write Protect (/WP) ....................................................................................................... 10 4.4 HOLD (/HOLD) ............................................................................................................. 10 4.5 Serial Clock (CLK) ........................................................................................................ 10 4.6 Reset (/RESET) ............................................................................................................ 10 5. BLOCK DIAGRAM .................................................................................................................... 11 6. FUNCTIONAL DESCRIPTIONS ............................................................................................... 12 6.1 Device Operation Flow ................................................................................................. 12 6.1.1 Standard SPI Instructions .............................................................................................. 12 6.1.2 Dual SPI Instructions...................................................................................................... 12 6.1.3 Quad SPI Instructions .................................................................................................... 13 6.1.4 DTR Read Instructions ................................................................................................... 13 6.1.5 Hold Function ................................................................................................................. 13 6.1.6 Software Reset & Hardware /RESET pin ....................................................................... 13 6.2 Write Protection ............................................................................................................ 14 6.3 DLP (Data Learning Pattern) ........................................................................................ 15 6.4 Interface States ............................................................................................................ 16 7. PROTECTION, CONFIGURATION AND STATUS REGISTERS ............................................ 17 7.1 Protection Register / Status Register-1 (Volatile Writable, OTP lockable) ................... 17 7.1.1 Block Protect Bits (BP3, BP2, BP1, BP0, TB) Volatile Writable, OTP lockable ........... 17 7.1.2 Write Protection Enable Bit (WP-E) Volatile Writable, OTP lockable .......................... 18 7.1.3 Status Register Protect Bits (SRP1, SRP0) Volatile Writable, OTP lockable .............. 18 7.2 Configuration Register / Status Register-2 (Volatile Writable ...................................... 19 7.2.1 One Time Program Lock Bit (OTP-L) OTP lockable.................................................... 19 7.2.2 Enter OTP Access Mode Bit (OTP-E) Volatile Writable .............................................. 19 7.2.3 Status Register-1 Lock Bit (SR1-L) OTP lockable ....................................................... 19 7.2.4 ECC Enable Bit (ECC-E) Volatile Writable .................................................................. 20 7.2.5 Buffer Read / Continuous Read Mode Bit (BUF) Volatile Writable .............................. 20 7.2.6 Quad Enable (QE) Volatile Writable ............................................................................ 20 7.3 Status Register-3 (Status only) .................................................................................... 21 7.3.1 Look-Up Table Full (LUT-F) Status Only ..................................................................... 21 7.3.2 Cumulative ECC Status (ECC-1, ECC-0) Status Only ................................................ 21 7.3.3 Program Failure (P-FAIL) Status Only ........................................................................ 22 th Release Date: November 18 , 2019 - 1 - Revision A

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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