X-On Electronics has gained recognition as a prominent supplier of W25N512GVEIG NAND Flash across the USA, India, Europe, Australia, and various other global locations. W25N512GVEIG NAND Flash are a product manufactured by Winbond. We provide cost-effective solutions for NAND Flash, ensuring timely deliveries around the world.

W25N512GVEIG Winbond

W25N512GVEIG electronic component of Winbond
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See Product Specifications
Part No.W25N512GVEIG
Manufacturer: Winbond
Category: NAND Flash
Description: NAND Flash 512Mb Serial NAND flash, 3V
Datasheet: W25N512GVEIG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.4441 ea
Line Total: USD 1.44 
Availability - 3602
Ship by Thu. 05 Dec to Tue. 10 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
3602
Ship by Thu. 05 Dec to Tue. 10 Dec
MOQ : 1
Multiples : 1
1 : USD 1.4441
10 : USD 1.219
30 : USD 1.0959
100 : USD 0.9556
500 : USD 0.8942
1000 : USD 0.8652

1988
Ship by Tue. 26 Nov to Thu. 28 Nov
MOQ : 1
Multiples : 1
1 : USD 2.442
10 : USD 2.068
100 : USD 1.903
504 : USD 1.837
1008 : USD 1.804
5040 : USD 1.683
10017 : USD 1.683

   
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We are delighted to provide the W25N512GVEIG from our NAND Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25N512GVEIG and other electronic components in the NAND Flash category and beyond.

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W25N512GVxIG/IT 3V 512M-BIT SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ Publication Release Date: November 21, 2018 Revision C W25N512GVxIG/IT Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 6 2. FEATURES ....................................................................................................................................... 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 7 3.1 Pad Configuration WSON 6x5-mm / 8x6-mm ...................................................................... 7 3.2 Pad Description WSON 6x5-mm / 8x6-mm .......................................................................... 7 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 8 3.4 Pin Description SOIC 300-mil ............................................................................................... 8 3.5 Ball Configuration TFBGA 8x6-mm (5x5 Ball Array) ............................................................ 9 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 9 4. PIN DESCRIPTIONS ...................................................................................................................... 10 4.1 Chip Select (/CS) ................................................................................................................ 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................. 10 4.3 Write Protect (/WP) ............................................................................................................. 10 4.4 HOLD (/HOLD) ................................................................................................................... 10 4.5 Serial Clock (CLK) .............................................................................................................. 10 5. BLOCK DIAGRAM .......................................................................................................................... 11 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12 6.1 Device Operation Flow ....................................................................................................... 12 6.1.1 Standard SPI Instructions ..................................................................................................... 12 6.1.2 Dual SPI Instructions ............................................................................................................ 12 6.1.3 Quad SPI Instructions ........................................................................................................... 13 6.1.4 Hold Function ........................................................................................................................ 13 6.2 Write Protection .................................................................................................................. 14 7. PROTECTION, CONFIGURATION AND STATUS REGISTERS .................................................. 15 7.1 Protection Register / Status Register-1 (Volatile Writable, OTP lockable) ......................... 15 7.1.1 Block Protect Bits (BP3, BP2, BP1, BP0, TB) Volatile Writable, OTP lockable .................. 15 7.1.2 Write Protection Enable Bit (WP-E) Volatile Writable, OTP lockable ................................. 16 7.1.3 Status Register Protect Bits (SRP1, SRP0) Volatile Writable, OTP lockable ..................... 16 7.2 Configuration Register / Status Register-2 (Volatile Writable) ........................................... 17 7.2.1 One Time Program Lock Bit (OTP-L) OTP lockable .......................................................... 17 7.2.2 Enter OTP Access Mode Bit (OTP-E) Volatile Writable ..................................................... 17 7.2.3 Status Register-1 Lock Bit (SR1-L) OTP lockable ............................................................. 17 7.2.4 ECC Enable Bit (ECC-E) Volatile Writable ......................................................................... 18 7.2.5 Buffer Read / Continuous Read Mode Bit (BUF) Volatile Writable ..................................... 18 7.2.6 Output Driver Strength (ODS-1, ODS-0) Volatile Writable ................................................. 19 7.2.7 Hold Disable (H-DIS) - Volatile Writable ............................................................................... 19 7.3 Status Register-3 (Status Only) .......................................................................................... 20 7.3.1 Look-Up Table Full (LUT-F) Status Only ............................................................................ 20 7.3.2 Cumulative ECC Status (ECC-1, ECC-0) Status Only ....................................................... 20 7.3.3 Program/Erase Failure (P-FAIL, E-FAIL) Status Only ........................................................ 21 7.3.4 Write Enable Latch (WEL) Status Only .............................................................................. 21 7.3.5 Erase/Program In Progress (BUSY) Status Only ............................................................... 21 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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