X-On Electronics has gained recognition as a prominent supplier of W25Q01JVZEIM NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q01JVZEIM NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q01JVZEIM Winbond

W25Q01JVZEIM electronic component of Winbond
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Part No.W25Q01JVZEIM
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash spiFlash 1G-bit 4Kb Uniform Sector
Datasheet: W25Q01JVZEIM Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 11.935 ea
Line Total: USD 11.94 
Availability - 161
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
161
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 11.935
10 : USD 10.714
25 : USD 9.889
100 : USD 9.35
252 : USD 9.141
504 : USD 8.646

   
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We are delighted to provide the W25Q01JVZEIM from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q01JVZEIM and other electronic components in the NOR Flash category and beyond.

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W25Q01JV 3V 1G-BIT (DUAL DIE) SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: November 13, 2019 -Revision B1 W25Q01JV Table of Contents 1. GENERAL DESCRIPTIONS ........................................................................................................ 5 2. FEATURES ................................................................................................................................. 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ...................................................................... 7 3.1 Pad Configuration WSON 8x6-mm .................................................................................. 7 3.2 Pad Description WSON 8x6-mm ..................................................................................... 7 3.3 Pin Configuration SOIC 300-mil ....................................................................................... 8 3.4 Pin Description SOIC 300-mil .......................................................................................... 8 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ............................................... 9 3.6 Ball Description TFBGA 8x6-mm ..................................................................................... 9 4. PIN DESCRIPTIONS ................................................................................................................. 10 4.1 Chip Select (/CS) ........................................................................................................... 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO12, IO3) ..................................... 10 4.3 Write Protect (/WP)........................................................................................................ 10 4.4 HOLD (/HOLD) .............................................................................................................. 10 4.5 Serial Clock (CLK) ......................................................................................................... 10 (1) 4.6 Reset (/RESET) .......................................................................................................... 10 5. BLOCK DIAGRAM .................................................................................................................... 12 6. FUNCTIONAL DESCRIPTIONS ................................................................................................ 13 6.1 SPI Operations .............................................................................................................. 13 6.1.1 Standard SPI Instructions ..................................................................................................... 13 6.1.2 Dual SPI Instructions ............................................................................................................ 13 6.1.3 Quad SPI Instructions ........................................................................................................... 13 6.1.4 3-Byte / 4-Byte Address Modes ............................................................................................ 14 6.1.5 Software Reset & Hardware /RESET pin ............................................................................. 14 6.2 Write Protection ............................................................................................................. 15 7. STATUS AND CONFIGURATION REGISTERS ........................................................................ 17 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 17 7.1.2 Write Enable Latch (WEL) Status Only ......................................................................... 18 7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) Volatile/Non-Volatile Writable ...................... 18 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ...................................... 18 7.1.5 Complement Protect (CMP) Volatile/Non-Volatile Writable ........................................... 18 7.1.6 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable .............................. 19 7.1.7 Erase/Program Suspend Status (SUS) Status Only ...................................................... 20 7.1.8 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable ......... 20 7.1.9 Quad Enable (QE) Volatile/Non-Volatile Writable .......................................................... 20 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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