X-On Electronics has gained recognition as a prominent supplier of W25Q16JLSSIG NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q16JLSSIG NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q16JLSSIG Winbond

W25Q16JLSSIG electronic component of Winbond
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Part No.W25Q16JLSSIG
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash spiFlash, 16M-bit, 4Kb Uniform Sector
Datasheet: W25Q16JLSSIG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1170: USD 0.5324 ea
Line Total: USD 622.91 
Availability - 0
MOQ: 1170  Multiples: 1170
Pack Size: 1170
Availability Price Quantity
0
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1170
Multiples : 1170
1170 : USD 0.5324
2340 : USD 0.5215
5850 : USD 0.4787
10530 : USD 0.4702
25740 : USD 0.4665

   
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We are delighted to provide the W25Q16JLSSIG from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q16JLSSIG and other electronic components in the NOR Flash category and beyond.

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W25Q16JL 2.5V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Publication Release Date: January 26, 2018 - 1 - -Revision D W25Q16JL Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES ............................................................................................................................ 6 3.1 Pin Configuration SOIC 150 / 208-mil, VSOP 150-MIL ........................................................ 6 3.2 PAD Configuration WSON 6x5-mm & USON 2x3-mm ........................................................ 6 3.3 Pin Description SOIC 150/208-mil, VSOP 150-mil, WSON 6x5-mm, USON 2x3-mm ......... 6 3.4 Pin Descriptions .................................................................................................................... 7 3.4.1 Chip Select (/CS) .................................................................................................................... 7 3.4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ....................................... 7 3.4.3 Write Protect (/WP) ................................................................................................................ 7 3.4.4 HOLD (/HOLD) ....................................................................................................................... 7 3.4.5 Serial Clock (CLK) .................................................................................................................. 7 3.5 Reset (/RESET) .................................................................................................................... 7 4. BLOCK DIAGRAM ............................................................................................................................ 8 5. FUNCTIONAL DESCRIPTION ......................................................................................................... 9 5.1 SPI OPERATIONS ............................................................................................................... 9 5.1.1 Standard SPI Instructions ....................................................................................................... 9 5.1.2 Dual SPI Instructions .............................................................................................................. 9 5.1.3 Quad SPI Instructions ............................................................................................................. 9 5.1.4 Hold Function ......................................................................................................................... 9 5.1.5 Software Reset & Hardware /RESET pin .............................................................................. 10 5.2 WRITE PROTECTION ....................................................................................................... 11 5.2.1 Write Protect Features ......................................................................................................... 11 6. CONTROL AND STATUS REGISTERS ......................................................................................... 12 6.1 STATUS REGISTER .......................................................................................................... 12 6.1.1 BUSY .................................................................................................................................... 12 6.1.2 Write Enable Latch (WEL) .................................................................................................... 12 6.1.3 Block Protect Bits (BP2, BP1, BP0) ...................................................................................... 12 6.1.4 Top/Bottom Block Protect (TB) ............................................................................................. 12 6.1.5 Sector/Block Protect (SEC) .................................................................................................. 12 6.1.6 Complement Protect (CMP) .................................................................................................. 12 6.1.7 Status Register Protect (SRP, SRL) ..................................................................................... 13 6.1.8 Erase/Program Suspend Status (SUS) ................................................................................ 13 6.1.9 Security Register Lock Bits (LB3, LB2, LB1) ........................................................................ 13 6.1.10 Quad Enable (QE) .............................................................................................................. 14 6.1.11 Write Protect Selection (WPS) Volatile/Non-Volatile Writable ..................................... 15 - 2 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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