X-On Electronics has gained recognition as a prominent supplier of W25Q20EWSNIG NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q20EWSNIG NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q20EWSNIG Winbond

W25Q20EWSNIG electronic component of Winbond
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Part No.W25Q20EWSNIG
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash spiFlash, 1.8V, 2M-bit, 4Kb Uniform Sector
Datasheet: W25Q20EWSNIG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.547 ea
Line Total: USD 0.55 
Availability - 540
Ship by Thu. 14 Nov to Mon. 18 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
540
Ship by Thu. 14 Nov to Mon. 18 Nov
MOQ : 1
Multiples : 1
1 : USD 0.547
10 : USD 0.4419
100 : USD 0.3925
500 : USD 0.3888
1000 : USD 0.3562
2000 : USD 0.332

   
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Icon ROHS
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We are delighted to provide the W25Q20EWSNIG from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q20EWSNIG and other electronic components in the NOR Flash category and beyond.

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W25Q20EW 1.8V 2M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS, DUAL AND QUAD SPI Publication Release Date: August 22, 2017 - 1 - -Revision I W25Q20EW Table of Contents 1. GENERAL DESCRIPTION ......................................................................................................... 5 2. FEATURES ................................................................................................................................. 5 4. PACKAGE TYPES AND PIN CONFIGURATIONS..................................................................... 6 4.1 Pin Configuration SOIC 150-mil and VSOP 150-mil....................................................... 6 4.2 PAD Configuration USON 2x3-mm/ USON 4x3-mm ...................................................... 6 4.3 Pin Description SOIC/ VSOP 150-mil, USON 2x3-mm/4x3-mm .................................... 6 4.4 Ball Configuration WLCSP .............................................................................................. 7 4.5 Ball Description WLCSP ................................................................................................. 7 5. PIN DESCRIPTIONS .................................................................................................................. 8 5.1 Chip Select (/CS) ............................................................................................................ 8 5.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ............................... 8 5.3 Write Protect (/WP) ......................................................................................................... 8 5.4 HOLD (/HOLD)................................................................................................................ 8 5.5 Serial Clock (CLK) .......................................................................................................... 8 6. BLOCK DIAGRAM ...................................................................................................................... 9 7. FUNCTIONAL DESCRIPTION.................................................................................................. 10 7.1 SPI OPERATIONS ....................................................................................................... 10 7.1.1 Standard SPI Instructions ............................................................................................... 10 7.1.2 Dual SPI Instructions ...................................................................................................... 10 7.1.3 Quad SPI Instructions ..................................................................................................... 10 7.1.4 Hold Function .................................................................................................................. 10 7.2 WRITE PROTECTION .................................................................................................. 11 7.2.1 Write Protect Features .................................................................................................... 11 8. CONTROL AND STATUS REGISTERS ................................................................................... 12 8.1 STATUS REGISTER .................................................................................................... 12 8.1.1 BUSY .............................................................................................................................. 12 8.1.2 Write Enable Latch (WEL) .............................................................................................. 12 8.1.3 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 12 8.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 12 8.1.5 Sector/Block Protect (SEC) ............................................................................................. 12 8.1.6 Complement Protect (CMP) ............................................................................................ 12 8.1.7 Protection and Special One time Programming Setting .................................................. 13 8.1.8 Erase/Program Suspend Status (SUS) ........................................................................... 14 8.1.9 Security Register Lock Bits (LB 3:0 ) Volatile/Non-Volatile OTP Writable ................. 14 8.1.1 Quad Enable (QE) .......................................................................................................... 14 8.1.2 Status Register Memory Protection (CMP = 0) ............................................................... 16 8.1.3 Status Register Memory Protection (CMP = 1) ............................................................... 17 8.2 INSTRUCTIONS ........................................................................................................... 18 8.2.1 Manufacturer and Device Identification ........................................................................... 18 (1) 8.2.2 Instruction Set Table 1 (Erase, Program Instructions) ................................................. 19 8.2.3 Instruction Set Table 2 .................................................................................................... 19 8.3 Instruction Descriptions ................................................................................................ 21 8.3.1 Write Enable (06h) .......................................................................................................... 21 Publication Release Date: August 22, 2017 - 2 - -Revision I

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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