X-On Electronics has gained recognition as a prominent supplier of W25Q32JVSNIM NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q32JVSNIM NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q32JVSNIM Winbond

W25Q32JVSNIM electronic component of Winbond
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Part No.W25Q32JVSNIM
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash spiFlash, 32M-bit, 4Kb Uniform Sector
Datasheet: W25Q32JVSNIM Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.7997 ea
Line Total: USD 0.8 
Availability - 1690
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1690
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 0.7997
10 : USD 0.6754
100 : USD 0.6204
1000 : USD 0.5995
2500 : USD 0.5643
5000 : USD 0.5357
10000 : USD 0.5346

   
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We are delighted to provide the W25Q32JVSNIM from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q32JVSNIM and other electronic components in the NOR Flash category and beyond.

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W25Q32JV-DTR 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI & DTR Publication Release Date: March 27, 2018 Revision G W25Q32JV-DTR Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 4 2. FEATURES ....................................................................................................................................... 4 3. ACKAGE TYPES AND PIN CONFIGURATIONS ............................................................................. 5 3.1 Pin Configuration SOIC 150 / 208-mil .................................................................................. 5 3.2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm ............................................................ 5 3.3 Pin Description SOIC 150/208-mil, WSON 6x5-mm, XSON 4x4-mm .................................. 5 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 6 3.5 Pin Description SOIC 300-mil ............................................................................................... 6 3.1 Ball Configuration TFBGA 8x6-mm (6x4 Ball Array) ............................................................ 7 3.2 Ball Description TFBGA 8x6-mm ......................................................................................... 7 4. PIN DESCRIPTIONS ........................................................................................................................ 8 4.1 Chip Select (/CS) .................................................................................................................. 8 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 8 4.3 Write Protect (/WP) ............................................................................................................... 8 4.4 HOLD (/HOLD) ..................................................................................................................... 8 4.5 Serial Clock (CLK) ................................................................................................................ 8 4.6 Reset (/RESET) .................................................................................................................... 8 5. BLOCK DIAGRAM ............................................................................................................................ 9 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 10 6.1 SPI / QPI Operations .......................................................................................................... 10 Standard SPI Instructions ..................................................................................................... 10 Dual SPI Instructions ............................................................................................................ 10 Quad SPI Instructions ........................................................................................................... 11 QPI Instructions .................................................................................................................... 11 SPI / QPI DTR Read Instructions .......................................................................................... 11 Hold Function ........................................................................................................................ 11 Software Reset & Hardware /RESET pin .............................................................................. 12 6.2 Write Protection .................................................................................................................. 13 Write Protect Features .......................................................................................................... 13 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 14 Status Registers .............................................................................................................................. 14 Erase/Write In Progress (BUSY) Status Only ................................................................. 14 Write Enable Latch (WEL) Status Only ........................................................................... 14 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................. 14 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ........................................ 15 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ........................................ 15 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 15 Status Register Protect (SRP, SRL) ..................................................................................... 16 Erase/Program Suspend Status (SUS) Status Only ....................................................... 17 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable ......... 17 Quad Enable (QE) Volatile/Non-Volatile Writable ......................................................... 17 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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