X-On Electronics has gained recognition as a prominent supplier of W25Q40CLSSIG TR NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q40CLSSIG TR NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q40CLSSIG TR Winbond

W25Q40CLSSIG TR electronic component of Winbond
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Part No.W25Q40CLSSIG TR
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash spiFlash, 4M-bit, 4Kb Uniform Sector
Datasheet: W25Q40CLSSIG TR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 0.7893
10 : USD 0.7859
100 : USD 0.508
500 : USD 0.5054
2000 : USD 0.4122
10000 : USD 0.4071
24000 : USD 0.3969
N/A

Obsolete
   
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RoHS - XON
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We are delighted to provide the W25Q40CLSSIG TR from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q40CLSSIG TR and other electronic components in the NOR Flash category and beyond.

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W25Q40CL 2.5/3/3.3V 4 M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS, DUAL AND QUAD SPI Publication Release Date: July 28, 2017 - 1 - Revision E W25Q40CL Table of Contents 1. GENERAL DESCRIPTION ......................................................................................................... 5 2. FEATURES ................................................................................................................................. 5 3. PIN CONFIGURATION SOIC 150-MIL, VSOP 150-MIL, TSSOP 173-MIL ................................ 6 4. PAD CONFIGURATION USON 2X3-MM ................................................................................... 6 5. PIN DESCRIPTION SOIC 150-MIL ............................................................................................ 6 5.1 Package Types ............................................................................................................... 7 5.2 Chip Select (/CS) ............................................................................................................ 7 5.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ............................... 7 5.4 Write Protect (/WP) ......................................................................................................... 7 5.5 HOLD (/HOLD)................................................................................................................ 7 5.6 Serial Clock (CLK) .......................................................................................................... 7 6. BLOCK DIAGRAM ...................................................................................................................... 8 7. FUNCTIONAL DESCRIPTION.................................................................................................... 9 7.1 SPI OPERATIONS ......................................................................................................... 9 7.1.1 Standard SPI Instructions ................................................................................................. 9 7.1.2 Dual SPI Instructions ........................................................................................................ 9 7.1.3 Quad SPI Instructions....................................................................................................... 9 7.1.4 Hold Function ................................................................................................................... 9 7.2 WRITE PROTECTION .................................................................................................. 10 7.2.1 Write Protect Features .................................................................................................... 10 8. CONTROL AND STATUS REGISTERS ................................................................................... 11 8.1 STATUS REGISTER .................................................................................................... 11 8.1.1 BUSY .............................................................................................................................. 11 8.1.2 Write Enable Latch (WEL) .............................................................................................. 11 8.1.3 Block Protect Bits (BP2, BP1, BP0) ................................................................................ 11 8.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 11 8.1.5 Sector/Block Protect (SEC) ............................................................................................ 11 8.1.6 Complement Protect (CMP) ........................................................................................... 11 8.1.7 Status Register Protect (SRP1, SRP0)........................................................................... 12 8.1.8 Erase/Program Suspend Status (SUS) .......................................................................... 12 8.1.9 Security Register Lock Bits (LB3, LB2, LB1, LB0) .......................................................... 12 8.1.10 Quad Enable (QE) ........................................................................................................ 13 8.1.11 Status Register Memory Protection (CMP = 0) ............................................................. 14 8.1.12 Status Register Memory Protection (CMP = 1) ............................................................. 15 9. INSTRUCTIONS ....................................................................................................................... 16 9.1.1 Manufacturer and Device Identification .......................................................................... 16 9.1.2 Instruction Set Table 1 (Erase, Program Instructions) .................................................... 17 9.1.3 Instruction Set Table 2 (Read Instructions) .................................................................... 18 9.1.4 Instruction Set Table 3 (ID, Security Instructions) .......................................................... 19 9.1.5 Write Enable (06h).......................................................................................................... 20 9.1.6 Write Enable for Volatile Status Register (50h) .............................................................. 20 9.1.7 Write Disable (04h) ......................................................................................................... 21 9.1.8 Read Status Register-1 (05h) and Read Status Register-2 (35h) .................................. 21 Publication Release Date: July 28, 2017 - 2 - Revision E

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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