X-On Electronics has gained recognition as a prominent supplier of W25Q64FVZPIGTR NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q64FVZPIGTR NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q64FVZPIGTR Winbond

W25Q64FVZPIGTR electronic component of Winbond
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See Product Specifications
Part No.W25Q64FVZPIGTR
Manufacturer: Winbond
Category: NOR Flash
Description: 64MB SERIAL NOR FLASH, WSON8 5 6 PACKAGE
Datasheet: W25Q64FVZPIGTR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
36: USD 1.7204 ea
Line Total: USD 61.93 
Availability - 0
MOQ: 36  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 36
Multiples : 1
36 : USD 1.7204
100 : USD 1.6036

   
Manufacturer
Product Category
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We are delighted to provide the W25Q64FVZPIGTR from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q64FVZPIGTR and other electronic components in the NOR Flash category and beyond.

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W25Q64FV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: June 14, 2016 - 1 Revision Q W25Q64FV Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pin Configuration SOIC / VSOP 208-mil .............................................................................. 6 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm, XSON 4x4-mm ........................................... 6 3.3 Pin Configuration PDIP 300-mil ............................................................................................ 7 3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm, XSON 4x4-mm and PDIP 300- mil 7 3.5 Pin Configuration SOIC 300-mil ........................................................................................... 8 3.6 Pin Description SOIC 300-mil ............................................................................................... 8 3.7 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 9 3.8 Ball Description TFBGA 8x6-mm ......................................................................................... 9 3.9 Ball Configuration WLCSP ................................................................................................. 10 3.10 Ball Description WLCSP ..................................................................................................... 10 4. PIN DESCRIPTIONS ...................................................................................................................... 11 4.1 Chip Select (/CS) ................................................................................................................ 11 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ................................... 11 4.3 Write Protect (/WP) ............................................................................................................ 11 4.4 HOLD (/HOLD) ................................................................................................................... 11 4.5 Serial Clock (CLK) .............................................................................................................. 11 5. BLOCK DIAGRAM .......................................................................................................................... 12 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 13 6.1 SPI/QPI OPERATIONS ...................................................................................................... 13 6.1.1 Standard SPI Instructions ..................................................................................................... 13 6.1.2 Dual SPI Instructions ............................................................................................................ 13 6.1.3 Quad SPI Instructions ........................................................................................................... 14 6.1.4 QPI Instructions .................................................................................................................... 14 6.1.5 Hold Function ....................................................................................................................... 14 6.2 WRITE PROTECTION ....................................................................................................... 15 6.2.1 Write Protect Features ......................................................................................................... 15 7. STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 16 7.1 STATUS REGISTERS ........................................................................................................ 16 7.1.1 BUSY .................................................................................................................................... 16 7.1.2 Write Enable Latch (WEL) .................................................................................................... 16 7.1.3 Block Protect Bits (BP2, BP1, BP0) ...................................................................................... 16 7.1.4 Top/Bottom Block Protect (TB) ............................................................................................. 16 7.1.5 Sector/Block Protect (SEC) .................................................................................................. 16 - 2 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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