X-On Electronics has gained recognition as a prominent supplier of W25Q16DVZPIG NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q16DVZPIG NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q16DVZPIG Winbond

W25Q16DVZPIG electronic component of Winbond
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Part No.W25Q16DVZPIG
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash Serial-SPI 3V/3.3V 16M-bit 2M x 8 7ns 8-Pin WSON EP
Datasheet: W25Q16DVZPIG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
69: USD 0.8979 ea
Line Total: USD 61.96 
Availability - 0
MOQ: 69  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 69
Multiples : 1
69 : USD 0.8979
100 : USD 0.8722

   
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We are delighted to provide the W25Q16DVZPIG from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q16DVZPIG and other electronic components in the NOR Flash category and beyond.

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W25Q16DV 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Publication Release Date: May 23, 2016 - 1 - Revision K W25Q16DV Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pin Configuration SOIC 150 / 208-mil .................................................................................. 6 3.2 Pad Configuration WSON 6x5-mm / USON 4X3-mm / USON 4X4-mm .............................. 6 3.3 Pin Configuration PDIP 300-mil ............................................................................................ 7 3.4 Pin Description SOIC 150/208-mil, WSON 6x5-mm / USON 4x3-mm / PDIP 300-mil ........ 7 3.5 Ball Configuration WLCSP ................................................................................................... 8 3.6 Ball Description WLCSP ....................................................................................................... 8 3.7 Pin Configuration SOIC 300-mil ........................................................................................... 9 3.8 Pin Description SOIC 300-mil ............................................................................................... 9 3.9 Ball Configuration TFBGA 8x6-mm .................................................................................... 10 3.10 Ball Description TFBGA 8x6-mm ....................................................................................... 10 4. PIN DESCRIPTIONS ...................................................................................................................... 11 4.1 Chip Select (/CS) ................................................................................................................ 11 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ................................... 11 4.3 Write Protect (/WP) ............................................................................................................ 11 4.4 HOLD (/HOLD) ................................................................................................................... 11 4.5 Serial Clock (CLK) .............................................................................................................. 11 5. BLOCK DIAGRAM .......................................................................................................................... 12 6. FUNCTIONAL DESCRIPTION ....................................................................................................... 13 6.1 SPI OPERATIONS ............................................................................................................. 13 6.1.1 Standard SPI Instructions ..................................................................................................... 13 6.1.2 Dual SPI Instructions ............................................................................................................ 13 6.1.3 Quad SPI Instructions ........................................................................................................... 13 6.1.4 Hold Function ....................................................................................................................... 13 6.2 WRITE PROTECTION ....................................................................................................... 14 6.2.1 Write Protect Features ......................................................................................................... 14 7. STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 15 7.1 STATUS REGISTERS ........................................................................................................ 15 7.1.1 BUSY Status (BUSY) ............................................................................................................ 15 7.1.2 Write Enable Latch Status (WEL) ........................................................................................ 15 7.1.3 Block Protect Bits (BP2, BP1, BP0) ...................................................................................... 15 7.1.4 Top/Bottom Block Protect Bit (TB) ........................................................................................ 15 7.1.5 Sector/Block Protect Bit (SEC) ............................................................................................. 15 7.1.6 Complement Protect Bit (CMP) ............................................................................................ 16 - 2 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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