X-On Electronics has gained recognition as a prominent supplier of W25Q16DWZPIG NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q16DWZPIG NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q16DWZPIG Winbond

W25Q16DWZPIG electronic component of Winbond
W25Q16DWZPIG Winbond
W25Q16DWZPIG NOR Flash
W25Q16DWZPIG  Semiconductors

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Part No. W25Q16DWZPIG
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash Serial-SPI 1.8V 16M-bit 2M x 8 7ns 8-Pin WSON EP
Datasheet: W25Q16DWZPIG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
88: USD 0.8081 ea
Line Total: USD 71.11 
Availability - 0
MOQ: 88  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 02 Jan to Wed. 08 Jan
MOQ : 88
Multiples : 1
88 : USD 0.8081

   
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We are delighted to provide the W25Q16DWZPIG from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q16DWZPIG and other electronic components in the NOR Flash category and beyond.

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W25Q16DW 1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: September 1, 2014 - 1 - Revision J W25Q16DW Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 6 3.1 Pin Configuration SOIC 150 / 208-mil .................................................................................. 6 3.2 Pad Configuration WSON 6x5-mm, USON 4x3-mm ............................................................ 6 3.3 Pin Description SOIC 150 / 208-mil, WSON 6x5-mm, USON 4x3-mm ............................... 6 3.4 Ball Configuration WLCSP ................................................................................................... 7 3.5 Ball Description WLCSP ....................................................................................................... 7 3.6 Pin Configuration SOIC16 300-mil ....................................................................................... 8 3.7 Pin Description SOIC16 300-mil........................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9 4.3 Write Protect (/WP)............................................................................................................... 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTION ....................................................................................................... 11 6.1 SPI/QPI OPERATIONS ...................................................................................................... 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions ........................................................................................................... 12 6.1.4 QPI Instructions .................................................................................................................... 12 6.1.5 Hold Function ........................................................................................................................ 12 6.2 WRITE PROTECTION ....................................................................................................... 13 6.2.1 Write Protect Features .......................................................................................................... 13 7. STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 14 7.1 STATUS REGISTERS........................................................................................................ 14 7.1.1 BUSY .................................................................................................................................... 14 7.1.2 Write Enable Latch (WEL) .................................................................................................... 14 7.1.3 Block Protect Bits (BP2, BP1, BP0) ...................................................................................... 14 7.1.4 Top/Bottom Block Protect (TB) ............................................................................................. 14 7.1.5 Sector/Block Protect (SEC) ................................................................................................... 14 7.1.6 Complement Protect (CMP) .................................................................................................. 14 7.1.7 Status Register Protect (SRP1, SRP0) ................................................................................. 15 7.1.8 Erase/Program Suspend Status (SUS) ................................................................................. 15 7.1.9 Security Register Lock Bits (LB3, LB2, LB1, LB0) ................................................................ 15 7.1.10 Quad Enable (QE) .............................................................................................................. 15 - 2 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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