X-On Electronics has gained recognition as a prominent supplier of W25Q80BLSNIG NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q80BLSNIG NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q80BLSNIG Winbond

W25Q80BLSNIG electronic component of Winbond
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Part No.W25Q80BLSNIG
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash Serial-SPI 2.5V/3.3V 8M-bit 1M x 8 9ns 8-Pin SOIC
Datasheet: W25Q80BLSNIG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
95: USD 0.657 ea
Line Total: USD 62.42 
Availability - 0
MOQ: 95  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 95
Multiples : 1
95 : USD 0.657
100 : USD 0.6192

   
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Programmable
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We are delighted to provide the W25Q80BLSNIG from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q80BLSNIG and other electronic components in the NOR Flash category and beyond.

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W25Q80BL 2.5V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Publication Release Date: April 07,2014 - 1 - Revision G1 W25Q80BL Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES ............................................................................................................................ 6 3.1 Pin Configuration SOIC 150 / 208-mil, VSOP 150-mil .......................................................... 6 3.2 PAD Configuration WSON 6x5-mm, USON 2X3-MM .......................................................... 6 3.3 Pin Description SOIC, VSOP, WSON, USON ...................................................................... 7 3.4 Pin Descriptions .................................................................................................................... 8 3.4.1 Chip Select (/CS) ................................................................................................................... 8 3.4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ....................................... 8 3.4.3 Write Protect (/WP) ................................................................................................................ 8 3.4.4 HOLD (/HOLD) ....................................................................................................................... 8 3.5 Serial Clock (CLK) ................................................................................................................ 8 4. BLOCK DIAGRAM ............................................................................................................................ 9 5. FUNCTIONAL DESCRIPTION ....................................................................................................... 10 5.1 SPI OPERATIONS ............................................................................................................. 10 5.1.1 Standard SPI Instructions .................................................................................................... 10 5.1.2 Dual SPI Instructions ............................................................................................................ 10 5.1.3 Quad SPI Instructions .......................................................................................................... 10 5.1.4 Hold Function ....................................................................................................................... 10 5.2 WRITE PROTECTION ....................................................................................................... 11 5.2.1 Write Protect Features ......................................................................................................... 11 6. CONTROL AND STATUS REGISTERS ......................................................................................... 12 6.1 STATUS REGISTER .......................................................................................................... 12 6.1.1 BUSY.................................................................................................................................... 12 6.1.2 Write Enable Latch (WEL) ................................................................................................... 12 6.1.3 Block Protect Bits (BP2, BP1, BP0) ..................................................................................... 12 6.1.4 Top/Bottom Block Protect (TB) ............................................................................................. 12 6.1.5 Sector/Block Protect (SEC) .................................................................................................. 12 6.1.6 Complement Protect (CMP) ................................................................................................. 13 6.1.7 Status Register Protect (SRP1, SRP0) ................................................................................ 13 6.1.8 Erase/Program Suspend Status (SUS) ................................................................................ 13 6.1.9 Security Register Lock Bits (LB3, LB2, LB1) ........................................................................ 13 6.1.10 Quad Enable (QE) .............................................................................................................. 14 6.1.11 Status Register Memory Protection (CMP = 0) .................................................................. 15 6.1.12 Status Register Memory Protection (CMP = 1) .................................................................. 16 6.2 INSTRUCTIONS ................................................................................................................. 17 6.2.1 Manufacturer and Device Identification ................................................................................ 17 (1) 6.2.2 Instruction Set Table 1 (Erase, Program Instructions) ...................................................... 18 - 2 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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