Product Information

W25Q80BLSNIG TR

W25Q80BLSNIG TR electronic component of Winbond

Datasheet
W25Q80BLSNIG TR winbond flash memory integrated circuits ics semiconductors

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

104: USD 0.8839 ea
Line Total: USD 91.93

0 - Global Stock
MOQ: 104  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 104
Multiples : 1
104 : USD 0.8839

     
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W25Q80BL 2.5V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Publication Release Date: July 08, 2010 - 1 - Preliminary - Revision C W25Q80BL Table of Contents 1. GENERAL DESCRIPTION...............................................................................................................5 2. FEATURES.......................................................................................................................................5 3. PIN CONFIGURATION SOIC 150 / 208-MIL ...................................................................................6 4. PAD CONFIGURATION WSON 6X5-MM ........................................................................................6 5. PIN CONFIGURATION PDIP 300-MIL.............................................................................................7 6. PIN DESCRIPTION SOIC 150/208-MIL, WSON 6X5-MM, AND PDIP 300-MIL..............................7 6.1 Package Types.....................................................................................................................8 6.2 Chip Select (/CS)..................................................................................................................8 6.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ....................................8 6.4 Write Protect (/WP)...............................................................................................................8 6.5 HOLD (/HOLD) .....................................................................................................................8 6.6 Serial Clock (CLK)................................................................................................................8 7. BLOCK DIAGRAM............................................................................................................................9 8. FUNCTIONAL DESCRIPTION .......................................................................................................10 8.1 SPI OPERATIONS .............................................................................................................10 8.1.1 Standard SPI Instructions.....................................................................................................10 8.1.2 Dual SPI Instructions............................................................................................................10 8.1.3 Quad SPI Instructions...........................................................................................................10 8.1.4 Hold Function .......................................................................................................................10 8.2 WRITE PROTECTION .......................................................................................................11 8.2.1 Write Protect Features..........................................................................................................11 9. CONTROL AND STATUS REGISTERS ........................................................................................12 9.1 STATUS REGISTER..........................................................................................................12 9.1.1 BUSY....................................................................................................................................12 9.1.2 Write Enable Latch (WEL)....................................................................................................12 9.1.3 Block Protect Bits (BP2, BP1, BP0)......................................................................................12 9.1.4 Top/Bottom Block Protect (TB).............................................................................................12 9.1.5 Sector/Block Protect (SEC) ..................................................................................................12 9.1.6 Complement Protect (CMP) .................................................................................................13 9.1.7 Status Register Protect (SRP1, SRP0).................................................................................13 9.1.8 Erase/Program Suspend Status (SUS) ................................................................................13 9.1.9 Security Register Lock Bits (LB3, LB2, LB1) ........................................................................13 9.1.10 Quad Enable (QE)..............................................................................................................14 9.1.11 Status Register Memory Protection (CMP = 0)...................................................................15 9.1.12 Status Register Memory Protection (CMP = 1)...................................................................16 9.2 INSTRUCTIONS.................................................................................................................17 - 2 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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