X-On Electronics has gained recognition as a prominent supplier of W25Q80BLSNIG TR NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q80BLSNIG TR NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q80BLSNIG TR Winbond

W25Q80BLSNIG TR electronic component of Winbond
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See Product Specifications
Part No.W25Q80BLSNIG TR
Manufacturer: Winbond
Category: NOR Flash
Description: W25Q80BLSNIG TR winbond flash memory integrated circuits ics semiconductors
Datasheet: W25Q80BLSNIG TR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
104: USD 0.8295 ea
Line Total: USD 86.27 
Availability - 0
MOQ: 104  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 104
Multiples : 1
104 : USD 0.8295

   
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We are delighted to provide the W25Q80BLSNIG TR from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q80BLSNIG TR and other electronic components in the NOR Flash category and beyond.

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W25Q80BL 2.5V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Publication Release Date: July 08, 2010 - 1 - Preliminary - Revision C W25Q80BL Table of Contents 1. GENERAL DESCRIPTION...............................................................................................................5 2. FEATURES.......................................................................................................................................5 3. PIN CONFIGURATION SOIC 150 / 208-MIL ...................................................................................6 4. PAD CONFIGURATION WSON 6X5-MM ........................................................................................6 5. PIN CONFIGURATION PDIP 300-MIL.............................................................................................7 6. PIN DESCRIPTION SOIC 150/208-MIL, WSON 6X5-MM, AND PDIP 300-MIL..............................7 6.1 Package Types.....................................................................................................................8 6.2 Chip Select (/CS)..................................................................................................................8 6.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ....................................8 6.4 Write Protect (/WP)...............................................................................................................8 6.5 HOLD (/HOLD) .....................................................................................................................8 6.6 Serial Clock (CLK)................................................................................................................8 7. BLOCK DIAGRAM............................................................................................................................9 8. FUNCTIONAL DESCRIPTION .......................................................................................................10 8.1 SPI OPERATIONS .............................................................................................................10 8.1.1 Standard SPI Instructions.....................................................................................................10 8.1.2 Dual SPI Instructions............................................................................................................10 8.1.3 Quad SPI Instructions...........................................................................................................10 8.1.4 Hold Function .......................................................................................................................10 8.2 WRITE PROTECTION .......................................................................................................11 8.2.1 Write Protect Features..........................................................................................................11 9. CONTROL AND STATUS REGISTERS ........................................................................................12 9.1 STATUS REGISTER..........................................................................................................12 9.1.1 BUSY....................................................................................................................................12 9.1.2 Write Enable Latch (WEL)....................................................................................................12 9.1.3 Block Protect Bits (BP2, BP1, BP0)......................................................................................12 9.1.4 Top/Bottom Block Protect (TB).............................................................................................12 9.1.5 Sector/Block Protect (SEC) ..................................................................................................12 9.1.6 Complement Protect (CMP) .................................................................................................13 9.1.7 Status Register Protect (SRP1, SRP0).................................................................................13 9.1.8 Erase/Program Suspend Status (SUS) ................................................................................13 9.1.9 Security Register Lock Bits (LB3, LB2, LB1) ........................................................................13 9.1.10 Quad Enable (QE)..............................................................................................................14 9.1.11 Status Register Memory Protection (CMP = 0)...................................................................15 9.1.12 Status Register Memory Protection (CMP = 1)...................................................................16 9.2 INSTRUCTIONS.................................................................................................................17 - 2 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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