X-On Electronics has gained recognition as a prominent supplier of W25Q64JWUUIQ TR NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q64JWUUIQ TR NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25Q64JWUUIQ TR Winbond

W25Q64JWUUIQ TR electronic component of Winbond
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Part No.W25Q64JWUUIQ TR
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash spiFlash, 1.8V 64M-bit, 4Kb Uniform Sector
Datasheet: W25Q64JWUUIQ TR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.243 ea
Line Total: USD 1.24 
Availability - 2100
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2100
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 1.243
10 : USD 0.9801
100 : USD 0.957
500 : USD 0.9295
1000 : USD 0.8943
5000 : USD 0.8195
10000 : USD 0.8008
25000 : USD 0.8008

   
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We are delighted to provide the W25Q64JWUUIQ TR from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q64JWUUIQ TR and other electronic components in the NOR Flash category and beyond.

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W25Q64JW 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI Publication Release Date: November 04, 2019 -Revision B W25Q64JW Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................ 4 2. FEATURES ..................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 5 3.1 Pin Configuration SOIC 208-mil............................................................................................ 5 3.2 Pad Configuration WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm, USON4x3-mm ....................... 5 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm, USON 4x3-mm ... 5 3.4 Ball Configuration TFBGA 8x6-mm (5x5 Ball Array).............................................................. 6 3.5 Ball Description TFBGA 5x5 ................................................................................................. 6 3.6 Ball Configuration WLCSP ................................................................................................... 7 3.7 Ball Description WLCSP12 ................................................................................................... 7 4. PIN DESCRIPTIONS ....................................................................................................................... 8 4.1 Chip Select (/CS) ................................................................................................................. 8 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ....................................... 8 4.3 Write Protect (/WP) .............................................................................................................. 8 4.4 HOLD (/HOLD) .................................................................................................................... 8 4.5 Serial Clock (CLK) ............................................................................................................... 8 (1) 4.6 Reset (/RESET) ................................................................................................................ 8 5. BLOCK DIAGRAM ........................................................................................................................... 9 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 10 6.1 Standard SPI Instructions................................................................................................... 10 6.2 Dual SPI Instructions.......................................................................................................... 10 6.3 Quad SPI Instructions ........................................................................................................ 10 6.4 Software Reset & Hardware /RESET pin ............................................................................ 10 6.5 Write Protection ................................................................................................................. 11 Write Protect Features ............................................................................................................... 11 7. STATUS AND CONFIGURATION REGISTERS ............................................................................. 12 7.1 Status Registers ................................................................................................................ 12 Erase/Write In Progress (BUSY) Status Only ...................................................................... 12 Write Enable Latch (WEL) Status Only ................................................................................ 12 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ...................................... 12 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ............................................. 13 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ............................................. 13 Complement Protect (CMP) Volatile/Non-Volatile Writable ................................................. 13 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ..................................... 14 Erase/Program Suspend Status (SUS) Status Only ............................................................ 15 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable ................ 15 Quad Enable (QE) Volatile/Non-Volatile Writable .............................................................. 15 Write Protect Selection (WPS) Volatile/Non-Volatile Writable............................................ 16 Output Driver Strength (DRV1, DRV0) Volatile/Non-Volatile Writable ............................... 16 Reserved Bits Non Functional ........................................................................................... 16 Status Register Memory Protection (WPS = 0, CMP = 0) ........................................................ 17 Publication Release Date: November 04, 2019 - 1 - -Revision B

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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