X-On Electronics has gained recognition as a prominent supplier of W25R256JVFIQ NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25R256JVFIQ NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

W25R256JVFIQ Winbond

W25R256JVFIQ electronic component of Winbond
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See Product Specifications
Part No.W25R256JVFIQ
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash RPMC spiFlash 3V 256M-bit
Datasheet: W25R256JVFIQ Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 4.8185 ea
Line Total: USD 4.82

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Tue. 06 Aug to Thu. 08 Aug
MOQ : 1
Multiples : 1
1 : USD 4.8185
10 : USD 4.37
100 : USD 3.818
176 : USD 3.8065
528 : USD 3.657
1056 : USD 3.5535
2640 : USD 3.473
5104 : USD 3.335
10032 : USD 3.289

   
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We are delighted to provide the W25R256JVFIQ from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25R256JVFIQ and other electronic components in the NOR Flash category and beyond.

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W25R256JV 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & RPMC Publication Release Date: June 16, 2020 Preliminary - Revision D W25R256JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 6 3.2 Pad Description WSON 8x6-mm .......................................................................................... 6 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.4 Pin Description SOIC 300-mil ............................................................................................... 7 4. PIN DESCRIPTIONS ........................................................................................................................ 8 4.1 Chip Select (/CS) .................................................................................................................. 8 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 8 4.3 Serial Clock (CLK) ................................................................................................................ 8 5. BLOCK DIAGRAM ............................................................................................................................ 9 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 10 6.1 SPI Operations ................................................................................................................... 10 6.1.1 Standard SPI Instructions ..................................................................................................... 10 6.1.2 Dual SPI Instructions ............................................................................................................ 10 6.1.3 Quad SPI Instructions ........................................................................................................... 11 6.1.4 3-Byte / 4-Byte Address Modes ............................................................................................ 11 6.1.5 Software Reset ..................................................................................................................... 11 6.2 RPMC OPERATIONS ........................................................................................................ 12 6.2.1 RPMC Initialization ............................................................................................................... 12 6.2.2 RPMC Operation Flow .......................................................................................................... 13 6.2.3 Operations Allowed / Disallowed During RPMC Operation .................................................. 14 6.2.4 RPMC Status Register Definition .......................................................................................... 15 6.3 Write Protection .................................................................................................................. 16 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 17 7.1 Status Registers ................................................................................................................. 17 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 17 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 17 7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) Volatile/Non-Volatile Writable ....................... 18 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 18 7.1.5 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 18 7.1.6 Status Register Protect (SRP1, SRP0) Volatile/Non-Volatile Writable ........................... 18 7.1.7 Erase/Program Suspend Status (SUS) Status Only....................................................... 19 7.1.8 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable .......... 19 7.1.9 Quad Enable (QE) Volatile/Non-Volatile Writable .......................................................... 19 7.1.10 Current Address Mode (ADS) Status Only ................................................................... 20 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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