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X-On Electronics has gained recognition as a prominent supplier of W988D2FBJX6E DRAM across the USA, India, Europe, Australia, and various other global locations. W988D2FBJX6E DRAM are a product manufactured by Winbond. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

W988D2FBJX6E Winbond

W988D2FBJX6E electronic component of Winbond
W988D2FBJX6E Winbond
W988D2FBJX6E DRAM
W988D2FBJX6E  Semiconductors

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See Product Specifications
Part No. W988D2FBJX6E
Manufacturer: Winbond
Category: DRAM
Description: DRAM Chip Mobile LPSDR SDRAM 256Mbit 8Mx32 1.8V 90-Pin VFBGA
Datasheet: W988D2FBJX6E Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 240
Multiples : 1
240 : USD 4.9016
250 : USD 4.8521
500 : USD 4.8038
1000 : USD 4.7554
2000 : USD 4.7085
2500 : USD 4.6614
3000 : USD 4.6144
4000 : USD 4.5687
5000 : USD 4.5229
10000 : USD 4.4772
N/A

Obsolete
0
MOQ : 1
Multiples : 1
1 : USD 5.2051
10 : USD 3.4718
25 : USD 3.3986
50 : USD 3.3776
100 : USD 3.0744
240 : USD 3.064
480 : USD 2.9803
N/A

Obsolete
   
Manufacturer
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Type
Mounting Style
Package / Case
Data Bus Width
Organisation
Memory Size
Maximum Clock Frequency
Supply Voltage - Max
Supply Voltage - Min
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Series
Hts Code
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the W988D2FBJX6E from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W988D2FBJX6E and other electronic components in the DRAM category and beyond.

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W988D6FB / W988D2FB 256Mb Mobile LPSDR Table of Contents- 1. GENERAL DESCRIPTION ......................................................................................................... 4 2. FEATURES ................................................................................................................................. 4 3. ORDER INFORMATION ............................................................................................................. 4 4. BALL CONFIGURATION ............................................................................................................ 5 4.1 Ball Assignment: LPSDR x16 ......................................................................................... 5 4.2 Ball Assignment: LPSDR x32 ......................................................................................... 6 5. BALL DESCRIPTION .................................................................................................................. 7 5.1 Signal Description ........................................................................................................... 7 5.2 Addressing Table ............................................................................................................ 8 6. BLOCK DIAGRAM ...................................................................................................................... 9 7. FUNCTIONAL DESCRIPTION.................................................................................................. 10 7.1 Command Function ...................................................................................................... 10 7.1.1 Table 1. Truth Table (Note (1) and (2)) ................................................................... 10 7.1.2 Functional Truth Table (See Note 1) ...................................................................... 11 7.1.3 Functional Truth Table for CKE .............................................................................. 14 7.1.4 Bank Activate Command ........................................................................................ 15 7.1.5 Bank Precharge Command .................................................................................... 15 7.1.6 Precharge All Command ........................................................................................ 15 7.1.7 Write Command ...................................................................................................... 15 7.1.8 Write with Auto Precharge Command .................................................................... 15 7.1.9 Read Command ..................................................................................................... 15 7.1.10 Read with Auto Precharge Command .................................................................... 15 7.1.11 Extended Mode Register Set Command ................................................................ 16 7.1.12 Mode Register Set Command ................................................................................ 16 7.1.13 No-Operation Command ........................................................................................ 16 7.1.14 Burst Stop Command ............................................................................................. 16 7.1.15 Device Deselect Command .................................................................................... 16 7.1.16 Auto Refresh Command ......................................................................................... 16 7.1.17 Self Refresh Entry Command ................................................................................. 16 7.1.18 Self Refresh Exit Command ................................................................................... 17 7.1.19 Clock Suspend Mode Entry/Power Down Mode Entry Command .......................... 17 7.1.20 Clock Suspend Mode Exit/Power Down Mode Exit Command ............................... 17 7.1.21 Data Write/Output Enable, Data Mask/Output Disable Command .......................... 17 8. OPERATION ............................................................................................................................. 17 8.1 Read Operation ............................................................................................................. 17 8.2 Write Operation ............................................................................................................. 18 8.3 Precharge ..................................................................................................................... 18 8.3.1 Auto Precharge ....................................................................................................... 18 8.3.2 READ with auto precharge interrupted by a READ (with or without auto precharge) 19 Publication Release Date: Sep. 22, 2014 Revision: A01-006 - 1 - W988D6FB / W988D2FB 8.3.3 READ with auto precharge interrupted by a WRITE (with or without auto precharge) 19 8.3.4 WRITE with auto precharge interrupted by a READ (with or without auto precharge) 20 8.3.5 WRITE with auto precharge interrupted by a WRITE (with or without auto precharge) 20 8.4 Burst Termination.......................................................................................................... 21 8.5 Mode Register Operation .............................................................................................. 22 8.5.1 Burst Length field (A2~A0) ..................................................................................... 22 8.5.2 Addressing Mode Select (A3) ................................................................................. 22 8.5.3 Addressing Sequence for Sequential Mode ........................................................... 22 8.5.4 Addressing Sequence for Interleave Mode ............................................................. 23 8.5.5 Addressing Sequence Example (Burst Length = 8 and Input Address is 13) ......... 23 8.5.6 Read Cycle CAS Latency = 3 ................................................................................. 23 8.5.7 CAS Latency field (A6~A4) ..................................................................................... 24 8.5.8 Mode Register Definition ........................................................................................ 24 8.6 Extended Mode Register Description ........................................................................... 25 8.7 Simplified State Diagram .............................................................................................. 26 9. ELECTRICAL CHARACTERISTICS ......................................................................................... 27 9.1 Absolute Maximum Ratings .......................................................................................... 27 9.2 Operating Conditions .................................................................................................... 27 9.3 Capacitance .................................................................................................................. 27 9.4 DC Characteristics ........................................................................................................ 28 9.5 Automatic Temperature Compensated Self Refresh Current Feature ......................... 28 9.6 AC Characteristics and Operating Condition ................................................................ 29 9.6.1 AC Characteristics .................................................................................................. 29 9.6.2 AC Test Condition .................................................................................................. 30 9.6.3 AC Latency Characteristics .................................................................................... 31 10. CONTROL TIMING WAVEFORMS .......................................................................................... 32 10.1 Command Input Timing ................................................................................................ 32 10.2 Read Timing .................................................................................................................. 33 10.3 Control Timing of Input Data (x16)................................................................................ 34 10.4 Control Timing of Output Data (x16) ............................................................................. 35 10.5 Control Timing of Input Data (x32)................................................................................ 36 10.6 Control Timing of Output Data (x32) ............................................................................. 37 10.7 Mode Register Set (MRS) Cycle ................................................................................... 38 10.8 Extended Mode register Set (EMRS) Cycle ................................................................. 39 11. OPERATING TIMING EXAMPLE ............................................................................................. 40 11.1 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3) ...................................... 40 11.2 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto-precharge) ........... 41 11.3 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3) ...................................... 42 11.4 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto-precharge) ........... 43 11.5 Interleaved Bank Write (Burst Length = 8) ................................................................... 44 11.6 Interleaved Bank Write (Burst Length = 8, Auto-precharge) ........................................ 45 11.7 Page Mode Read (Burst Length = 4, CAS Latency = 3) .............................................. 46 Publication Release Date: Sep. 22, 2014 Revision: A01-006 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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