X-On Electronics has gained recognition as a prominent supplier of C3M0065100J SiC MOSFETs across the USA, India, Europe, Australia, and various other global locations. C3M0065100J SiC MOSFETs are a product manufactured by Wolfspeed. We provide cost-effective solutions for SiC MOSFETs, ensuring timely deliveries around the world.

C3M0065100J Wolfspeed

C3M0065100J electronic component of Wolfspeed
C3M0065100J Wolfspeed
C3M0065100J SiC MOSFETs
C3M0065100J  Semiconductors

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Part No. C3M0065100J
Manufacturer: Wolfspeed
Category: SiC MOSFETs
Description: SiC MOSFETs 1000V 65mOhm G3 SiC MOSFET TO-263-7
Datasheet: C3M0065100J Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 14.8415 ea
Line Total: USD 14.84 
Availability - 4
Ship by Fri. 10 Jan to Wed. 15 Jan
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
4
Ship by Fri. 10 Jan to Wed. 15 Jan
MOQ : 1
Multiples : 1
1 : USD 14.8415
10 : USD 14.3589

733
Ship by Wed. 01 Jan to Fri. 03 Jan
MOQ : 1
Multiples : 1
1 : USD 18.607
10 : USD 18.018
25 : USD 17.5213
50 : USD 15.7888
500 : USD 15.4308
2500 : USD 15.3962

   
Manufacturer
Product Category
Mounting Style
Transistor Polarity
Number of Channels
Vds - Drain-Source Breakdown Voltage
Id - Continuous Drain Current
Rds On - Drain-Source Resistance
Vgs - Gate-Source Voltage
Vgs th - Gate-Source Threshold Voltage
Qg - Gate Charge
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Channel Mode
Package / Case
Hts Code
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the C3M0065100J from our SiC MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the C3M0065100J and other electronic components in the SiC MOSFETs category and beyond.

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V 1000 V DS I 25C 32 A D C3M0065100J R 65 m DS(on) Silicon Carbide Power MOSFET TM C3M MOSFET Technology N-Channel Enhancement Mode Features Package TM C3M SiC MOSFET technology TAB Drain Low parasitic inductance with separate driver source pin 7mm of creepage distance between drain and source High blocking voltage with low On-resistance Fast intrinsic diode with low reverse recovery (Qrr) Low output capacitance (60pF) Halogen free, RoHS compliant Benefits Drain (TAB) 1 2 3 4 5 6 7 Reduce switching losses and minimize gate ringing G KS S S S S S Higher system efficiency Increase power density Increase system switching frequency Gate (Pin 1) Applications Driver Power Source Source (Pin 2) (Pin 3,4,5,6,7) Renewable energy EV battery chargers High voltage DC/DC converters Switch Mode Power Supplies Marking Part Number Package C3M0065100J TO-263-7 C3M0065100J Maximum Ratings (T = 25 C unless otherwise specified) C Symbol Parameter Value Unit Test Conditions Note Drain - Source Voltage 1000 V V = 0 V, I = 100 A V GS D DSmax V Gate - Source Voltage (dynamic) -8/+19 V AC (f >1 Hz) Note. 1 GSmax V Gate - Source Voltage (static) -4/+15 V Static Note. 2 GSop 32 Fig. 19 V = 15 V, T = 25C GS C I Continuous Drain Current A D 21 V = 15 V, T = 100C GS C I Pulsed Drain Current 90 A Fig. 22 D(pulse) Pulse width t limited by T jmax P Avalanche energy, Single pulse 110 mJ I = 22A, V = 50V E D DD AS P Power Dissipation 113.5 W T =25C, T = 150 C Fig. 20 C J D -55 to Operating Junction and Storage Temperature C T , T J stg +150 T Solder Temperature 260 C 1.6mm (0.063) from case for 10s L Note (1): When using MOSFET Body Diode V = -4V/+19V GSmax Note (2): MOSFET can also safely operate at 0/+15 V 1 C3M0065100J Rev. 1, 09-2020Electrical Characteristics (T = 25C unless otherwise specified) C Symbol Parameter Min. Typ. Max. Unit Test Conditions Note V Drain-Source Breakdown Voltage 1000 V V = 0 V, I = 100 A (BR)DSS GS D 1.8 2.1 3.5 V VDS = VGS, ID = 5 mA V Gate Threshold Voltage Fig. 11 GS(th) 1.6 V V = V , I = 5 mA, T = 150C DS GS D J I Zero Gate Voltage Drain Current 1 100 A V = 1000 V, V = 0 V DSS DS GS I Gate-Source Leakage Current 10 250 nA V = 15 V, V = 0 V GSS GS DS 65 78 VGS = 15 V, ID = 20 A Fig. 4, R Drain-Source On-State Resistance m DS(on) 5, 6 95 VGS = 15 V, ID = 20A, TJ = 150C 14.3 V = 20 V, I = 20 A DS DS g Transconductance S Fig. 7 fs 11.9 V = 20 V, I = 20 A, T = 150C DS DS J Ciss Input Capacitance 760 Fig. 17, VGS = 0 V, VDS = 600 V C Output Capacitance 70 oss pF 18 f = 1 MHz C Reverse Transfer Capacitance 5 rss AC V = 25 mV E C Stored Energy 15 J Fig. 16 oss oss Fig. 26, E Turn-On Switching Energy (Body Diode FWD) 103 ON V = 700 V, V = -4 V/15 V, I = 20A, DS GS D J 30 R = 2.5, L= 130 H, T = 150C J G(ext) E Turn Off Switching Energy (Body Diode FWD) 30 Note. 3 OFF td(on) Turn-On Delay Time 7 V = 700 V, V = -4 V/15 V DD GS tr Rise Time 8 I = 20 A, R = 2.5 , D G(ext) ns Fig. 27 Timing relative to V DS t Turn-Off Delay Time 13 d(off) Inductive load t Fall Time 6 f , R Internal Gate Resistance 3.5 f = 1 MHz V = 25 mV G(int) AC Q Gate to Source Charge 9 gs VDS = 700 V, VGS = -4 V/15 V Q Gate to Drain Charge 9 I = 20 A gd nC D Fig. 12 Per IEC60747-8-4 pg 21 Qg Total Gate Charge 32 (T = 25C unless otherwise specified) Reverse Diode Characteristics C Symbol Parameter Typ. Max. Unit Test Conditions Note 4.5 V V = -4 V, I = 10 A GS SD Fig. 8, V Diode Forward Voltage SD 9, 10 4.2 V V = -4 V, I = 10 A, T = 150 C GS SD J I Continuous Diode Forward Current 22 A V = -4 V Note 1 S GS I Diode pulse Current 90 A Note 1 S, pulse V = -4 V, pulse width t limited by T jmax GS P t Reverse Recovery time 15 ns rr V = -4 V, I = 20 A, V = 700 V GS SD R Note 1 Q Reverse Recovery Charge 159 nC rr dif/dt = 4500 A/s, T = 150 C J I Peak Reverse Recovery Current 19 A rrm Thermal Characteristics Test Conditions Note Symbol Parameter Max. Unit R Thermal Resistance from Junction to Case 1.1 JC C/W Fig. 21 RJA Thermal Resistance From Junction to Ambient 40 Note (3): Turn-off and Turn-on switching energy and timing values measured using SiC MOSFET Body Diode 2 C3M0065100J Rev. 1, 09-2020

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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