AOT15S60/AOB15S60/AOTF15S60 TM 600V 15A MOS Power Transistor General Description Product Summary V T 700V The AOT15S60& AOB15S60 & AOTF15S60 have been DS j,max TM fabricated using the advanced MOS high voltage I 63A DM process that is designed to deliver high levels of R 0.29 DS(ON),max performance and robustness in switching applications. Q 16nC g,typ By providing low R , Q and E along with DS(on) g OSS E 400V 3.6J oss guaranteed avalanche capability these parts can be adopted quickly into new and existing offline power supply designs. 100% UIS Tested 100% R Tested g For Halogen Free add suffix to part number: AOT15S60L & AOB15S60L & AOTF15S60L Top View TO-263 TO-220 TO-220F D 2 D PAK D G S S S D D S G G G AOT15S60 AOTF15S60 AOB15S60 Absolute Maximum Ratings T =25C unless otherwise noted A Parameter Symbol AOT15S60/AOB15S60 AOTF15S60L Units Drain-Source Voltage V 600 V DS Gate-Source Voltage V 30 V GS T =25C 15 15* C Continuous Drain I D Current T =100C 10 10* A C C Pulsed Drain Current I 63 DM C Avalanche Current I 2.4 A AR C Repetitive avalanche energy E 86 mJ AR G Single pulsed avalanche energy E 173 mJ AS T =25C 208 27.8 W C P D B o o Power Dissipation Derate above 25 C 1.67 0.22 W/ C 100 MOSFET dv/dt ruggedness dv/dt V/ns H Peak diode recovery dv/dt 20 Junction and Storage Temperature Range T , T -55 to 150 C J STG Maximum lead temperature for soldering J purpose, 1/8 from case for 5 seconds T 300 C L Thermal Characteristics Parameter AOT15S60/AOB15S60 AOTF15S60L Units Symbol A,D R Maximum Junction-to-Ambient JA 65 65 C/W A R Maximum Case-to-sink CS 0.5 -- C/W Maximum Junction-to-Case R 0.6 4.5 C/W JC * Drain current limited by maximum junction temperature. www.aosmd.com Rev 0: Aug 2011 Page 1 of 6 AOT15S60/AOB15S60/AOTF15S60 Electrical Characteristics (T =25C unless otherwise noted) J Symbol Parameter Conditions Min Typ Max Units STATIC PARAMETERS I =250A, V =0V, T =25C 600 - - D GS J BV Drain-Source Breakdown Voltage DSS I =250A, V =0V, T =150C 650 700 - V D GS J V =600V, V =0V - - 1 DS GS I Zero Gate Voltage Drain Current A DSS V =480V, T =150C - 10 - DS J I Gate-Body leakage current V =0V, V =30V - - 100 n GSS DS GS V V =5V,I =250A Gate Threshold Voltage 2.5 3.2 3.8 V GS(th) DS D V =10V, I =7.5A, T =25C - 0.254 0.29 GS D J R Static Drain-Source On-Resistance DS(ON) V =10V, I =7.5A, T =150C - 0.68 0.78 GS D J V Diode Forward Voltage I =7.5A,V =0V, T =25C - 0.83 - V SD S GS J I Maximum Body-Diode Continuous Current - - 15 A S C I Maximum Body-Diode Pulsed Current - - 63 A SM DYNAMIC PARAMETERS C Input Capacitance - 717 - pF iss V =0V, V =100V, f=1MHz GS DS C Output Capacitance - 58 - pF oss Effective output capacitance, energy C - 41.2 - pF o(er) H related V =0V, V =0 to 480V, f=1MHz GS DS Effective output capacitance, time C - 125.2 - pF o(tr) I related V =0V, V =100V, f=1MHz C Reverse Transfer Capacitance - 1.3 - pF GS DS rss V =0V, V =0V, f=1MHz R Gate resistance - 13.4 - g GS DS SWITCHING PARAMETERS Q Total Gate Charge - 15.6 - nC g Q Gate Source Charge V =10V, V =480V, I =7.5A - 3.5 - nC GS DS D gs Q Gate Drain Charge - 6.0 - nC gd t Turn-On DelayTime - 24.5 - ns D(on) t Turn-On Rise Time V =10V, V =400V, I =7.5A, - 22 - ns GS DS D r R =25 t Turn-Off DelayTime G - 84 - ns D(off) t Turn-Off Fall Time - 24 - ns f t I =7.5A,dI/dt=100A/s,V =400V - 282 rr Body Diode Reverse Recovery Time F DS - ns I I =7.5A,dI/dt=100A/s,V =400V Peak Reverse Recovery Current - 26 rm F DS - A Q I =7.5A,dI/dt=100A/s,V =400V - 4.5 rr Body Diode Reverse Recovery Charge F DS - C A. The value of R is measured with the device in a still air environment with T =25C. JA A B. The power dissipation P is based on T =150C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation D J(MAX) limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature T =150C, Ratings are based on low frequency and duty cycles to keep initial T J(MAX) J =25C. D. The R is the sum of the thermal impedance from junction to case R and case to ambient. JA JC E. The static characteristics in Figures 1 to 6 are obtained using <300 s pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of T =150C. The SOA curve provides a single pulse rating. J(MAX) G. L=60mH, I =2.4A, V =150V, Starting T =25C AS DD J H. C is a fixed capacitance that gives the same stored energy as C while V is rising from 0 to 80% V o(er) oss DS (BR)DSS. I. C is a fixed capacitance that gives the same charging time as C while V is rising from 0 to 80% V o(tr) oss DS (BR)DSS. J. Wavesoldering only allowed at leads. THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev 0: Aug 2011 www.aosmd.com Page 2 of 6