X-On Electronics has gained recognition as a prominent supplier of DS1250AB-100 NVRAM across the USA, India, Europe, Australia, and various other global locations. DS1250AB-100 NVRAM are a product manufactured by Analog Devices. We provide cost-effective solutions for NVRAM, ensuring timely deliveries around the world.

DS1250AB-100 Analog Devices

DS1250AB-100 electronic component of Analog Devices
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See Product Specifications
Part No.DS1250AB-100
Manufacturer: Analog Devices
Category: NVRAM
Description: Maxim Integrated NVRAM 4096K NV SRAM
Datasheet: DS1250AB-100 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
5: USD 87.3862 ea
Line Total: USD 436.93 
Availability - 0
MOQ: 5  Multiples: 5
Pack Size: 5
Availability Price Quantity
0
Ship by Fri. 11 Oct to Thu. 17 Oct
MOQ : 5
Multiples : 5
5 : USD 87.3862
7 : USD 82.705
20 : USD 81.5192
30 : USD 80.3335
50 : USD 79.1478
250 : USD 77.9621
500 : USD 76.7763

0
Ship by Thu. 17 Oct to Mon. 21 Oct
MOQ : 1
Multiples : 1
1 : USD 142.844
10 : USD 123.6408
20 : USD 120.935
50 : USD 118.3838
100 : USD 112.7404

   
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We are delighted to provide the DS1250AB-100 from our NVRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the DS1250AB-100 and other electronic components in the NVRAM category and beyond.

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19-5647 Rev 12/10 DS1250Y/AB 4096k Nonvolatile SRAM www.maxim-ic.com FEATURES PIN ASSIGNMENT 10 years minimum data retention in the A18 1 32 V CC absence of external power 31 A16 A15 2 A14 A17 3 30 Data is automatically protected during power 4 29 A12 WE loss A7 A13 5 28 Replaces 512k x 8 volatile static RAM, A6 6 27 A8 A5 A9 EEPROM or Flash memory 7 26 A11 A4 8 25 Unlimited write cycles A3 OE 9 24 Low-power CMOS A2 10 23 A10 Read and write access times of 70ns A1 CE 11 22 12 21 A0 DQ7 Lithium energy source is electrically 13 20 DQ0 DQ6 disconnected to retain freshness until power is 14 19 DQ1 DQ5 applied for the first time DQ2 15 18 DQ4 Full 10% V operating range (DS1250Y) CC 17 GND 16 DQ3 Optional 5% V operating range CC 32-Pin ENCAPSULATED PACKAGE (DS1250AB) 740-mil EXTENDED Optional industrial temperature range of -40C to +85C, designated IND JEDEC standard 32-pin DIP package 34 A18 1 NC 2 33 A17 A15 PowerCap Module (PCM) package 3 32 A14 A16 31 4 A13 NC - Directly surface-mountable module 30 5 A12 V CC 6 29 A11 WE - Replaceable snap-on PowerCap provides 28 7 A10 OE 27 8 A9 lithium backup battery CE 26 9 A8 DQ7 25 - Standardized pinout for all nonvolatile 10 A7 DQ6 24 11 A6 DQ5 SRAM products 23 12 A5 DQ4 22 13 A4 DQ3 GND V BAT - Detachment feature on PCM allows easy 21 14 A3 DQ2 20 15 A2 DQ1 removal using a regular screwdriver 19 16 A1 DQ0 18 17 A0 GND 34-Pin POWERCAP MODULE (PCM) (Uese DS9034PC+ or DS9034PCI+ POWERCAP) PIN DESCRIPTION A0 - A18 - Address Inputs DQ0 - DQ7 - Data In/Data Out CE - Chip Enable WE - Write Enable OE - Output Enable V - Power (+5V) CC GND - Ground NC - No Connect 1 of 10 DS1250Y/AB DESCRIPTION The DS1250 4096k Nonvolatile SRAMs are 4,194,304-bit, fully static, nonvolatile SRAMs organized as 524,288 words by 8 bits. Each complete NV SRAM has a self-contained lithium energy source and control circuitry which constantly monitors V for an out-of-tolerance condition. When such a condition CC occurs, the lithium energy source is automatically switched on and write protection is unconditionally enabled to prevent data corruption. DIP-package DS1250 devices can be used in place of existing 512k x 8 static RAMs directly conforming to the popular byte-wide 32-pin DIP standard. DS1250 devices in the PowerCap Module package are directly surface mountable and are normally paired with a DS9034PC PowerCap to form a complete Nonvolatile SRAM module. There is no limit on the number of write cycles that can be executed and no additional support circuitry is required for microprocessor interfacing. READ MODE The DS1250 executes a read cycle whenever WE (Write Enable) is inactive (high) and CE (Chip Enable) and (Output Enable) are active (low). The unique address specified by the 19 address inputs (A - OE 0 A ) defines which of the 524,288 bytes of data is to be accessed. Valid data will be available to the eight 18 data output drivers within t (Access Time) after the last address input signal is stable, providing that ACC CE and OE (Output Enable) access times are also satisfied. If OE and CE access times are not satisfied, then data access must be measured from the later-occurring signal ( CE or OE ) and the limiting parameter is either t for CE or t for OE rather than address access. CO OE WRITE MODE The DS1250 executes a write cycle whenever the WE and CE signals are active (low) after address inputs are stable. The later-occurring falling edge of CE or WE will determine the start of the write cycle. The write cycle is terminated by the earlier rising edge of CE or WE . All address inputs must be kept valid throughout the write cycle. WE must return to the high state for a minimum recovery time (t ) WR before another cycle can be initiated. The OE control signal should be kept inactive (high) during write cycles to avoid bus contention. However, if the output drivers are enabled ( CE and OE active) then WE will disable the outputs in t from its falling edge. ODW DATA RETENTION MODE The DS1250AB provides full functional capability for V greater than 4.75 volts and write protects by CC 4.5 volts. The DS1250Y provides full functional capability for V greater than 4.5 volts and write CC protects by 4.25 volts. Data is maintained in the absence of V without any additional support circuitry. CC The nonvolatile static RAMs constantly monitor V . Should the supply voltage decay, the NV SRAMs CC automatically write protect themselves, all inputs become dont care, and all outputs become high- impedance. As V falls below approximately 3.0 volts, a power switching circuit connects the lithium CC energy source to RAM to retain data. During power-up, when V rises above approximately 3.0 volts, CC the power switching circuit connects external V to RAM and disconnects the lithium energy source. CC Normal RAM operation can resume after V exceeds 4.75 volts for the DS1250AB and 4.5 volts for the CC DS1250Y. FRESHNESS SEAL Each DS1250 device is shipped from Maxim with its lithium energy source disconnected, guaranteeing full energy capacity. When V is first applied at a level greater than 4.25 volts, the lithium energy source CC is enabled for battery back-up operation. 2 of 10

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
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