AUIRF1010Z AUIRF1010ZS AUTOMOTIVE GRADE AUIRF1010ZL Features HEXFET Power MOSFET Advanced Process Technology V 55V DSS Ultra Low On-Resistance R max. 7.5m DS(on) 175C Operating Temperature Fast Switching I 94A D (Silicon Limited) Repetitive Avalanche Allowed up to Tjmax I 75A D (Package Limited) Lead-Free, RoHS Compliant Automotive Qualified * D D Description Specifically designed for Automotive applications, this HEXFET S S S Power MOSFET utilizes the latest processing techniques to D G D G achieve extremely low on-resistance per silicon area. Additional G features of this design are a 175C junction operating temperature, 2 TO-220AB D Pak TO-262 fast switching speed and improved repetitive avalanche rating . AUIRF1010Z AUIRF1010ZS AUIRF1010ZL These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide G D S variety of other applications. Gate Drain Source Standard Pack Base part number Package Type Orderable Part Number Form Quantity AUIRF1010Z TO-220 Tube 50 AUIRF1010Z AUIRF1010ZL TO-262 Tube 50 AUIRF1010ZL Tube 50 AUIRF1010ZS 2 AUIRF1010ZS D -Pak Tape and Reel Left 800 AUIRF1010ZSTRL Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25C, unless otherwise specified. Symbol Parameter Max. Units I T = 25C Continuous Drain Current, V 10V (Silicon Limited) 94 D C GS I T = 100C Continuous Drain Current, V 10V (Silicon Limited) 66 D C GS A I T = 25C Continuous Drain Current, V 10V (Package Limited) 75 D C GS I Pulsed Drain Current 360 DM P T = 25C Maximum Power Dissipation 140 W D C Linear Derating Factor 0.90 W/C V Gate-to-Source Voltage 20 V GS E Single Pulse Avalanche Energy (Thermally Limited) 130 AS mJ E (tested) Single Pulse Avalanche Energy Tested Value 180 AS I Avalanche Current See Fig.15,16, 12a, 12b A AR E Repetitive Avalanche Energy mJ AR T Operating Junction and -55 to + 175 J T Storage Temperature Range C STG Soldering Temperature, for 10 seconds (1.6mm from case) 300 Mounting torque, 6-32 or M3 screw 10 lbfin (1.1Nm) Thermal Resistance Symbol Parameter Typ. Max. Units Junction-to-Case 1.11 R JC Case-to-Sink, Flat, Greased Surface 0.50 R CS C/W R Junction-to-Ambient 62 JA Junction-to-Ambient ( PCB Mount, steady state) 40 R JA HEXFET is a registered trademark of Infineon. *Qualification standards can be found at www.infineon.com 1 2017-09-18 AUIRF1010Z/S/L Static T = 25C (unless otherwise specified) J Parameter Min. Typ. Max. Units Conditions V Drain-to-Source Breakdown Voltage 55 V V = 0V, I = 250A (BR)DSS GS D Breakdown Voltage Temp. Coefficient 0.049 V/C Reference to 25C, I = 1mA V / T (BR)DSS J D R Static Drain-to-Source On-Resistance 5.8 7.5 m V = 10V, I = 75A DS(on) GS D V Gate Threshold Voltage 2.0 4.0 V V = V , I = 250A GS(th) DS GS D gfs Forward Trans conductance 33 S V = 25V, I = 75A DS D 20 V = 55 V, V = 0V DS GS I Drain-to-Source Leakage Current A DSS 250 V = 55V,V = 0V,T =125C DS GS J Gate-to-Source Forward Leakage 200 V = 20V GS I nA GSS Gate-to-Source Reverse Leakage -200 V = -20V GS Dynamic Electrical Characteristics T = 25C (unless otherwise specified) J Q Total Gate Charge 63 95 I = 75A g D Q Gate-to-Source Charge 19 nC V = 44V gs DS Q Gate-to-Drain Charge 24 V = 10V gd GS t Turn-On Delay Time 18 V = 28V d(on) DD t Rise Time 150 I = 75A r D ns t Turn-Off Delay Time 36 R = 6.8 d(off) G V = 10V t Fall Time 92 f GS Between lead, L Internal Drain Inductance 4.5 D 6mm (0.25in.) nH from package L Internal Source Inductance 7.5 S and center of die contact C Input Capacitance 2840 V = 0V iss GS C Output Capacitance 420 V = 25V oss DS = 1.0MHz, See Fig. 5 C Reverse Transfer Capacitance 250 rss pF C Output Capacitance 1630 V = 0V, V = 1.0V = 1.0MHz oss GS DS C Output Capacitance 360 V = 0V, V = 44V = 1.0MHz oss GS DS C Effective Output Capacitance 560 V = 0V, V = 0V to 44V oss eff. GS DS Diode Characteristics Parameter Min. Typ. Max. Units Conditions Continuous Source Current MOSFET symbol I 75 S (Body Diode) showing the A Pulsed Source Current integral reverse I 360 SM (Body Diode) p-n junction diode. V Diode Forward Voltage 1.3 V T = 25C,I = 75A,V = 0V SD J S GS t Reverse Recovery Time 22 33 ns T = 25C ,I = 75A, V = 25V rr J F DD Q Reverse Recovery Charge 15 23 nC di/dt = 100A/s rr t Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L +L ) S D on Notes: Repetitive rating pulse width limited by max. junction temperature. (See fig. 11) Limited by T starting T = 25C, L = 0.05mH, R = 25 , I = 75A, V =10V. Part not recommended for use above this value. Jmax, J G AS GS Pulse width 1.0ms duty cycle 2%. C eff. is a fixed capacitance that gives the same charging time as C while V is rising from 0 to 80% V . oss oss DS DSS Limited by T , see Fig.12a, 12b, 15, 16 for typical repetitive avalanche performance. Jmax This value determined from sample failure population, starting T = 25C, L = 0.05mH, R = 25, I = 75A, V =10V. J G AS GS This is only applied to TO-220AB package. When mounted on 1 square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note AN-994 R is measured at T approximately 90C. J 2 2017-09-18