X-On Electronics has gained recognition as a prominent supplier of BSD235C H6327 MOSFETs across the USA, India, Europe, Australia, and various other global locations. BSD235C H6327 MOSFETs are a product manufactured by Infineon. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

BSD235C H6327 Infineon

BSD235C H6327 electronic component of Infineon
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Part No.BSD235C H6327
Manufacturer: Infineon
Category: MOSFETs
Description: Infineon Technologies MOSFET N and P-Ch 20V 950mA -530mA SOT-363-6
Datasheet: BSD235C H6327 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.4279 ea
Line Total: USD 0.43 
Availability - 115471
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
7758
Ship by Fri. 06 Dec to Wed. 11 Dec
MOQ : 5
Multiples : 5
5 : USD 0.2826
50 : USD 0.2248
150 : USD 0.2001
500 : USD 0.1693
3000 : USD 0.1555
6000 : USD 0.1472

115471
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 0.4279
10 : USD 0.3333
100 : USD 0.2068
1000 : USD 0.1166
3000 : USD 0.1012
9000 : USD 0.0902
24000 : USD 0.0869
45000 : USD 0.0836
99000 : USD 0.0803

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Qualification
Brand
Factory Pack Quantity :
Configuration
Height
Length
Series
Transistor Type
Width
Forward Transconductance - Min
Cnhts
Fall Time
Hts Code
Mxhts
Product Type
Rise Time
Subcategory
Taric
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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We are delighted to provide the BSD235C H6327 from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BSD235C H6327 and other electronic components in the MOSFETs category and beyond.

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BSD235C OptiMOS 2 + OptiMOS-P 2 Small Signal Transistor Product Summary Features P N Complementary P + N channel V -20 20 V DS Enhancement mode R V =4.5 V 1200 350 mW DS(on),max GS Super Logic level (2.5V rated) V =2.5 V 2100 600 GS Avalanche rated I -0.53 0.95 A D Qualified according to AEC Q101 100% lead-free RoHS compliant PG-SOT-363 Halogen-free according to IEC61249-2-21 6 5 4 1 2 3 Type Package Tape and Reel Information Marking Lead Free Packing BSD235C PG-SOT-363 H6327: 3000 pcs / reel X9s Yes Non dry 1) Maximum ratings, at T =25 C, unless otherwise specified j Parameter Symbol Conditions Value Unit P N Continuous drain current I T =25C -0.53 0.95 A D A T =70C -0.46 0.76 A I T =25C Pulsed drain current -2.1 3.8 D,pulse A P: I =-0.53A, D N: I =0.95A, Avalanche energy, single pulse E 1.4 1.6 mJ D AS R =25W GS V Gate source voltage 12 V GS P T =25C 0.5 Power dissipation W tot A Operating and storage temperature T , T -55 ... 150 C j stg ESD class JESD22-A114-HBM 0 (<250V) C T 260 Soldering temperature C solder 55/150/56 IEC climatic category DIN IEC 68-1 1) Remark: only one of both transistors active Rev.2.4 page 1 2015-10-08BSD235C Values Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics Thermal resistance, junction - P 2) R - - 250 K/W minimal footprint thJA ambient N Electrical characteristics, at T =25 C, unless otherwise specified j Static characteristics V V =0V, I =-250A Drain-source breakdown voltage P - - -20 V (BR)DSS GS D V =0V, I =250A N 20 - - GS D Gate threshold voltage P V V =V , I =-1.5A -1.2 -0.9 -0.6 GS(th) DS GS D N V =V , I =1.6A 0.7 0.95 1.2 DS GS D V =-20V, V =0V, DS GS I Zero gate voltage drain current P - - -1 A DSS T =25C j V =20V, V =0V, DS GS N - - 1 T =25C j V =-20V, V =0V, DS GS P - - -100 T =150C j V =20V, V =0V, DS GS N - - 100 T =150C j P I V =12V, V =0V Gate-source leakage current - - 100 nA GSS GS DS N V =-2.5V, GS R P - 1221 2100 mW DS(on) I =-0.17A Drain-source on-state D resistance V =2.5V, I =0.29A N - 415 600 GS D V =-4.5V, I =- GS D P - 745 1200 0.53A V =4.5V, I =0.95A N - 266 350 GS D V >2 I R , DS D DS(on)max g Transconductance P - 0.7 - S fs I =-0.46A D V >2 I R , DS D DS(on)max N - 2 - I =0.76A D 2) 2 Performed on 40mm FR4 PCB. The traces are 1mm wide, 70 m thick and 20mm long they are present on both sides of the PCB Rev.2.4 page 2 2015-10-08

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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