X-On Electronics has gained recognition as a prominent supplier of BSD235NH6327XT MOSFETs across the USA, India, Europe, Australia, and various other global locations. BSD235NH6327XT MOSFETs are a product manufactured by Infineon. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

BSD235NH6327XT Infineon

BSD235NH6327XT electronic component of Infineon
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See Product Specifications
Part No.BSD235NH6327XT
Manufacturer: Infineon
Category: MOSFETs
Description: MOSFET OptiMOS 2 Small Signal Transistor
Datasheet: BSD235NH6327XT Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.418 ea
Line Total: USD 0.42 
Availability - 134252
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
134252
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 0.418
10 : USD 0.3201
100 : USD 0.1991
1000 : USD 0.1111
3000 : USD 0.0979
9000 : USD 0.088
24000 : USD 0.0825
45000 : USD 0.0803
99000 : USD 0.077

   
Manufacturer
Product Category
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Qualification
Configuration
Package Case
Series
Brand
Continuous Drain Current
Drain Source Breakdown Voltage
Gate Source Breakdown Voltage
Power Dissipation
Rds On
Fall Time
Gate Charge Qg
Rise Time
Factory Pack Quantity :
Typical Turn Off Delay Time
Rohs Mouser
Height
Length
Transistor Type
Width
Forward Transconductance - Min
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the BSD235NH6327XT from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BSD235NH6327XT and other electronic components in the MOSFETs category and beyond.

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BSD235N OptiMOS 2 Small-Signal-Transistor Product Summary Features V 20 V DS Dual N-channel R V =4.5 V 350 mW DS(on),max GS Enhancement mode V =2.5 V 600 GS Super Logic level (2.5V rated) I 0.95 A D Avalanche rated Qualified according to AEC Q101 PG-SOT-363 100% lead-free RoHS compliant 6 5 4 Halogen-free according to IEC61249-2-21 1 2 3 Type Package Tape and Reel Information Marking Lead Free Packing BSD235N PG-SOT-363 H6327: 3000 pcs/ reel X6s Yes Non dry Maximum ratings, at T =25 C, unless otherwise specified j 1) Value Symbol Conditions Unit Parameter Continuous drain current I T =25C 0.95 A D A T =70C 0.76 A I T =25C Pulsed drain current 3.8 D,pulse A E Avalanche energy, single pulse I =0.95A, R =16W 1.6 mJ AS D GS I =0.95A, V =16V, D DS Reverse diode dv /dt dv /dt di /dt =200A/s, 6 kV/s T =150C j,max Gate source voltage V 12 V GS P T =25C 0.5 Power dissipation W tot A T , T Operating and storage temperature -55 ... 150 C j stg ESD Class JESD22-A114 -HBM 0 (<250V) Soldering Temperature 260 C IEC climatic category DIN IEC 68-1 55/150/56 (1) Remark: only one of both transistors in operation. Rev 2.5 page 1 2014-07-29BSD235N Values Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics Thermal resistance, (2) R - - 250 K/W thJA minimal footprint junction - ambient Electrical characteristics, at T =25 C, unless otherwise specified j Static characteristics V V =0V, I =250A Drain-source breakdown voltage 20 - - V (BR)DSS GS D V V =V , I =1.6A Gate threshold voltage 0.7 0.95 1.2 GS(th) DS GS D V =20V, V =0V, DS GS I Drain-source leakage current - - 1 mA DSS T =25C j V =20V, V =0V, DS GS - - 100 T =150C j I V =12V, V =0V Gate-source leakage current - - 100 nA GSS GS DS R V =2.5V, I =0.29A Drain-source on-state resistance - 415 600 mW DS(on) GS D V =4.5V, I =0.95A - 266 350 GS D V >2 I R , DS D DS(on)max Transconductance g 2 - S fs I =0.76A D 2) 2 Performed on 40 mm FR4 PCB. The traces are 1mm wide, 70 m thick and 20mm long they are present on both sides of the PCB Rev 2.5 page 2 2014-07-29

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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