X-On Electronics has gained recognition as a prominent supplier of BSL316C H6327 MOSFETs across the USA, India, Europe, Australia, and various other global locations. BSL316C H6327 MOSFETs are a product manufactured by Infineon. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

BSL316C H6327 Infineon

BSL316C H6327 electronic component of Infineon
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See Product Specifications
Part No.BSL316C H6327
Manufacturer: Infineon
Category: MOSFETs
Description: Infineon Technologies MOSFET SMALL SIGNALP-CH
Datasheet: BSL316C H6327 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.4466 ea
Line Total: USD 0.45 
Availability - 46784
Ship by Thu. 26 Dec to Mon. 30 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2798
Ship by Mon. 06 Jan to Thu. 09 Jan
MOQ : 5
Multiples : 5
5 : USD 0.3303
50 : USD 0.2685
150 : USD 0.2422
500 : USD 0.2091
3000 : USD 0.1944
6000 : USD 0.1857

46784
Ship by Thu. 26 Dec to Mon. 30 Dec
MOQ : 1
Multiples : 1
1 : USD 0.4466
10 : USD 0.3883
100 : USD 0.2937
500 : USD 0.2376
1000 : USD 0.1936
3000 : USD 0.1694
9000 : USD 0.1584
24000 : USD 0.1562
45000 : USD 0.1529

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Series
Transistor Type
Brand
Factory Pack Quantity :
Configuration
Height
Length
Width
Forward Transconductance - Min
Cnhts
Fall Time
Hts Code
Mxhts
Product Type
Rise Time
Subcategory
Taric
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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We are delighted to provide the BSL316C H6327 from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BSL316C H6327 and other electronic components in the MOSFETs category and beyond.

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BSL316C OptiMOS 2 + OptiMOS-P 2 Small Signal Transistor Product Summary Features P N Complementary P + N channel V -30 30 V DS Enhancement mode R V =10 V 150 160 mW DS(on),max GS Logic level (4.5V rated) V =4.5 V 270 280 GS Avalanche rated I -1.5 1.4 A D Qualified according to AEC Q101 100% lead-free RoHS compliant PG-TSOP6 Halogen free according to IEC61249-2-21 6 5 4 1 2 3 Type Package Tape and Reel Information Marking Lead Free Packing BSL316C PG-TSOP-6 H6327: 3000 pcs / reel sPJ Yes Non dry 1) Maximum ratings, at T =25 C, unless otherwise specified j Parameter Symbol Conditions Value Unit P N Continuous drain current I T =25C -1.5 1.4 A D A T =70C -1.2 1.1 A I T =25C Pulsed drain current -6.0 5.6 D,pulse A P: I =-1.5A, D E N: I =1.4A, Avalanche energy, single pulse 11 3.7 mJ AS D R =25W GS V 20 Gate source voltage V GS 1) P T =25C 0.5 W Power dissipation tot A Operating and storage temperature T , T -55 ... 150 C j stg 0 (<250V) ESD class JESD22-A114-HBM T 260 Soldering temperature C solder IEC climatic category DIN IEC 68-1 55/150/56 1) Remark: only one of both transistors active Rev. 2.3 page 1 2014-07-21BSL316C Values Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics P Thermal resistance, junction - 2) R - - 250 K/W thJA minimal footprint 1) ambient N Electrical characteristics, at T =25 C, unless otherwise specified j Static characteristics V V =0V, I =-250A Drain-source breakdown voltage P - - -30 V (BR)DSS GS D N V =0V, I =250A 30 - - GS D V V =V , I =-11A Gate threshold voltage P -2 -1.5 -1 GS(th) DS GS D V =V , I =3.7A N 1.2 1.6 2 DS GS D V =-30V, V =0V, DS GS I Zero gate voltage drain current P - - -1 A DSS T =25C j V =30V, V =0V, DS GS N - - 1 T =25C j V =-30V, V =0V, DS GS P - - -100 T =150C j V =30V, V =0V, DS GS N - - 100 T =150C j Gate-source leakage current P I V =20V, V =0V - - 100 nA GSS GS DS N V =-4.5V, I =- GS D R P - 177 270 mW DS(on) 1.1A Drain-source on-state resistance V =4.5V, I =-1.1A N - 191 280 GS D V =-10V, I =-1.5A P - 113 150 GS D N V =10V, I =1.4A - 119 160 GS D V >2 I R , DS D DS(on)max g Transconductance P - 2.7 - S fs I =-1.18A D V >2 I R , DS D DS(on)max N - 2.3 - I =1.1A D 2) 2 Performed on 40mm FR4 PCB. The traces are 1mm wide, 70 m thick and 20mm long they are present on both sides of the PCB Rev. 2.3 page 2 2014-07-21

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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