BSO301SP H OptiMOS -P Power-Transistor Product Summary Features V -30 V DS P-Channel R 8.0 m DS(on),max V = 10 V GS Enhancement mode V = 4.5 V GS 12.0 A Logic level I -14.9 A D 150C operating temperature PG-DSO-8 Avalanche rated Qualified according JEDEC for target applications Pb-free lead plating RoHS compliant Halogen-free according to IEC61249-2-21 Type Package Marking Leadfree Halogen free packing BSO301SP H PG-DSO-8 301SP Yes Yes dry Maximum ratings, at T =25 C, unless otherwise specified j Value Parameter Symbol Conditions Unit 10 secs steady state 1) I Continuous drain current T =25 C -14.9 -12.6 A D A 1) -11.9 -10 T =70 C A 2) I -60 Pulsed drain current T =25 C D,pulse A Avalanche energy, single pulse E I =-14.9 A, R =25 248 mJ AS D GS V 20 Gate source voltage V GS 1) Power dissipation P T =25 C 2.5 1.79 W tot A T , T -55 ... 150 Operating and storage temperature C j stg ESD class JESD22-A114 HBM 1C (1kV - 2kV) 260 Soldering temperature C IEC climatic category DIN IEC 68-1 55/150/56 Rev. 1.32 page 1 2010-05-12BSO301SP H Values Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics Thermal resistance, R - - 35 K/W thJS junction - soldering point minimal footprint, Thermal resistance, R - - 110 thJA junction - ambient t 10 s p minimal footprint, - - 150 steady state 2 1) 6 cm cooling area , -- 50 t 10 s p 2 1) 6 cm cooling area , -- 80 steady state Electrical characteristics, at T =25 C, unless otherwise specified j Static characteristics Drain-source breakdown voltage V V =0 V, I =-250 A -30 - - V (BR)DSS GS D V =V , DS GS V Gate threshold voltage -1 -1.5 -2 GS(th) I =-250 A D V =-30 V, V =0 V, DS GS I Zero gate voltage drain current - -0.1 -1 A DSS T =25 C j V =-30 V, V =0 V, DS GS - -10 -100 T =125 C j I V =-20 V, V =0 V Gate-source leakage current - -10 -100 nA GSS GS DS R V =-4.5 V, I =-12 A Drain-source on-state resistance - 8.8 12 m DS(on) GS D R V =-10 V, I =-14.9 A Drain-source on-state resistance - 6.3 8.0 DS(on) GS D V >2 I R , DS D DS(on)max Transconductance g 22 44 - S fs I =-14.9 A D 1) 2 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.32 page 2 2010-05-12