BSO303P H OptiMOS -P Small-Signal-Transistor Product Summary Features V -30 V DS Dual P-Channel in SO8 V =-10V R 21 m W GS DS(on),max Enhancement mode V =-4.5V 32 GS Logic level I -8.2 A D 150C operating temperature Qualified according JEDEC for target applications SO 8 Halogen-free according to IEC61249-2-21 Pb-free lead plating RoHS compliant Type Package Marking Lead free Halogen free Packing BSO303P H PG-DSO- 8 Yes 303P Yes dry Maximum ratings, at T =25 C, unless otherwise specified j Parameter Symbol Conditions Value Unit 10 secs steady state 1) I T =25C -8,2 -7,0 A Continuous drain current D C T =70C -6,6 -5,8 C 2) I T =25C -32,8 Pulsed drain current D,pulse C Avalanche energy, single pulse E I =-8.2A, R =25W 97 mJ AS D GS V 20 Gate source voltage V GS P T =25C 2 Power dissipation W tot A Operating and storage temperature T , T -55 ... 150 C j stg ESD class JESD22-A114 HBM 1B (500V - 1kV) 260 C Soldering temperature IEC climatic category DIN IEC 68-1 55/150/56 Rev. 1.3 page 1 2010-02-10BSO303P H Parameter Symbol Conditions Values Unit min. typ. max. Thermal characteristics Thermal resistance, R - - 50 K/W thJS junction - soldering point minimal footprint, t< SMD version, device on PCB: R 10s 110 thJA minimal footprint, steady state 150 2 1) 6 cm cooling area - - 62,5 t<10s 2 1), 6 cm cooling area - - 80 steady state Electrical characteristics, at T =25 C, unless otherwise specified j Static characteristics Drain-source breakdown voltage V V =0V, I =-250A -30 - - V (BR)DSS GS D V V =V , I =-100A Gate threshold voltage -1 -1,5 -2 GS(th) DS GS D V =-30V, V =0V, DS GS Zero gate voltage drain current I - -0,1 -1 A DSS T =25C j V =-30V, V =0V, DS GS - -10 -100 T =150C j Gate-source leakage current I V =-20V, V =0V - - -100 nA GSS GS DS Drain-source on-state resistance R V =-4.5V, I =-6.6A - 25 32 mW DS(on) GS D V =-10V, I =-8.2A - 17 21 GS D V >2 I R , DS D DS(on)max g Transconductance 11 27 - S fs I =-6.6A D 1) 2 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air t10 sec. 2.) See figure3 for more detailed information Rev. 1.3 page 2 2010-02-10