X-On Electronics has gained recognition as a prominent supplier of BSP135 H6327 MOSFETs across the USA, India, Europe, Australia, and various other global locations. BSP135 H6327 MOSFETs are a product manufactured by Infineon. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

BSP135 H6327 Infineon

BSP135 H6327 electronic component of Infineon
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See Product Specifications
Part No.BSP135 H6327
Manufacturer: Infineon
Category: MOSFETs
Description: Infineon Technologies MOSFET N-Ch 600V 120mA SOT-223-3
Datasheet: BSP135 H6327 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.441 ea
Line Total: USD 1.44 
Availability - 83347
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
4
Ship by Fri. 06 Dec to Wed. 11 Dec
MOQ : 1
Multiples : 1
1 : USD 1.3141
10 : USD 1.1038
30 : USD 0.989
100 : USD 0.859
500 : USD 0.8016
1000 : USD 0.7767

83347
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 1.441
10 : USD 1.188
100 : USD 0.9207
500 : USD 0.781
1000 : USD 0.6347
2000 : USD 0.6204
10000 : USD 0.6193

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Series
Transistor Type
Brand
Forward Transconductance - Min
Fall Time
Rise Time
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
Height
Length
Width
Cnhts
Hts Code
Mxhts
Product Type
Factory Pack Quantity :
Subcategory
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We are delighted to provide the BSP135 H6327 from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BSP135 H6327 and other electronic components in the MOSFETs category and beyond.

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BSP135 SIPMOS Small-Signal-Transistor Product Summary Features V 600 V DS N-channel R 60 W DS(on),max Depletion mode I 0.02 A DSS,min dv /dt rated Available with V indicator on reel GS(th) Pb-free lead plating RoHS compliant PG-SOT223 Qualified according to AEC Q101 HalogenfreeaccordingtoIEC61249221 Type Package Tape and Reel Information Marking Packaging Type Package Tape and Reel Information Marking Packaging BSP135 PG-SOT223 H6327: 1000 pcs/reel BSP135 Non dry BSP135 PG-SOT223 L6327: 1000 pcs/reel BSP135 Non dry BSP135 PG-SOT223 H6906: 1000 pcs/reel BSP135 Non dry sorted in V bands1) BSP135 PG-SOT223 L6906: 1000 pcs/reel BSP135 Non dry GS(th) Maximum ratings, at T =25 C, unless otherwise specified j Value Parameter Symbol Conditions Unit Continuous drain current I T =25C 0.12 A D A T =70C 0.10 A I T =25C Pulsed drain current 0.48 D,pulse A I =0.12A, V =20V, D DS Reverse diode dv /dt dv /dt di /dt =200A/s, 6 kV/s T =150C j,max V Gate source voltage 20 V GS ESD Class 1A(>250V,<500V) (JESD22-A114-HBM) P T =25C Power dissipation 1.8 W tot A T , T Operating and storage temperature -55 ... 150 C j stg IEC climatic category DIN IEC 68-1 55/150/56 1) see table on next page and diagram 11 Rev. 1.3 3 page 1 2012-11-29BSP135 Parameter Symbol Conditions Values Unit min. typ. max. Thermal characteristics Thermal resistance, R - - 25 K/W thJS junction - soldering point (pin 4) SMD version, device on PCB R minimal footprint - - 115 thJA 2 2) - - 70 6 cm cooling area Electrical characteristics, at T =25 C, unless otherwise specified j Static characteristics Drain-source breakdown voltage V V =-3V, I =250A 600 - - V (BR)DSS GS D V V =3V, I =94A Gate threshold voltage -2.1 -1.4 -1 GS(th) DS D V =600V, DS Drain-source cutoff current I - - 0.1 A D(off) V =-3V, T =25C GS j V =600V, DS - - 10 V =-3V, T =125C GS j I V =20V, V =0V Gate-source leakage current - - 100 nA GSS GS DS I V =0V, V =10V On-state drain current 20 - - mA DSS GS DS R V =0V, I =0.01A Drain-source on-state resistance - 30 60 W DS(on) GS D V =10V, I =0.12A - 25 45 GS D V >2 I R , DS D DS(on)max Transconductance g 0.08 0.16 - S fs I =0.1A D 3) Threshold voltage V sorted in bands GS(th) J V V =3V, I =94A -1.2 - -1 V GS(th) DS D K -1.35 - -1.15 L -1.5 - -1.3 M -1.65 - -1.45 N -1.8 - -1.6 2) 2 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (single layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. 3) Each reel contains transistors out of one band whose identifying letter is printed on the reel label. A specific band cannot be ordered separately. Rev. 1.33 page 2 2012-11-29

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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