Rev 2. 4 BSP318S SIPMOS Small-Signal-Transistor Features Product Summary N-Channel Drain source voltage V 60 V DS Enhancement mode Drain-Source on-state resistance R 0.09 DS(on) Avalanche rated Continuous drain current I 2.6 A D Logic Level dv/dt rated 4 Pb-free lead plating RoHS compliant Qualified according to AEC Q101 3 HalogenfreeaccordingtoIEC61249221 2 1 VPS05163 Type Package Tape and Reel Marking Packaging BSP318S PG-SOT223 H6327: 1000 pcs/r BSP318S Non dry Maximum Ratings,at T = 25 C, unless otherwise specified j Parameter Symbol Value Unit Continuous drain current I 2.6 A D Pulsed drain current I 10.4 D puls T = 25 C A Avalanche energy, single pulse E 60 mJ AS I = 2.6 A, V = 25 V, R = 25 D DD GS Avalanche current,periodic limited by T I 2.6 A jmax AR Avalanche energy, periodic limited by T E 0.18 mJ jmax AR Reverse diode dv/dt dv/dt 6 kV/s I = 2.6 A, V = 20 V, di/dt = 200 A/s, S DS T = 150 C jmax Gate source voltage V V 20 GS Power dissipation P 1.8 W tot T = 25 C A Operating and storage temperature T , T -55... +150 C j stg IEC climatic category DIN IEC 68-1 55/150/56 ESD Class Class 1b JESD22-A114-HBM Page 1 20 12-11-28Rev 2.4 BSP318S Thermal Characteristics Parameter Symbol Values Unit min. typ. max. Characteristics Thermal resistance, junction - soldering point R - 17 - K/W thJS (Pin 4) SMD version, device on PCB: R thJA min. footprint - 100 - 2 1) 6 cm cooling area - - 70 Electrical Characteristics, at T = 25 C, unless otherwise specified j Parameter Symbol Values Unit min. typ. max. Static Characteristics Drain- source breakdown voltage V 60 - - V (BR)DSS V = 0 V, I = 0.25 mA GS D Gate threshold voltage, V = V V 1.2 1.6 2 GS DS GS(th) I = 20 A D Zero gate voltage drain current I A DSS V = 60 V, V = 0 V, T = 25 C - 0.1 1 DS GS j V = 60 V, V = 0 V, T = 150 C - - 100 DS GS j Gate-source leakage current I - 10 100 nA GSS V = 20 V, V = 0 V GS DS Drain-Source on-state resistance R - 0.12 0.15 DS(on) V = 4.5 V, I = 2.6 A GS D Drain-Source on-state resistance R - 0.07 0.09 DS(on) V = 10 V, I = 2.6 A GS D 1 2 Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical without blown air. Page 2 2012-11-28