BSZ086P03NS3 G TM OptiMOS P3 Power-Transistor Product Summary V -30 V Features DS R 8.6 single P-Channel in S3O8 mW DS(on),max 1) Qualified according JEDEC for target applications I -40 A D PG-TSDSON-8 150 C operating temperature V =25 V, specially suited for notebook applications GS Pb-free RoHS compliant applications: battery management, load switching Halogen-free according to IEC61249-2-21 Type Package Marking Lead free Halogen free Packing Yes BSZ086P03NS3 G PG-TSDSON-8 086P3N Yes non-dry Maximum ratings, at T =25 C, unless otherwise specified j Value Parameter Symbol Conditions Unit Continuous drain current I T =25C -40 A D C T =70C -40 C 2) -13.5 T =25 C A 3) Pulsed drain current I -160 T =25C D,pulse C Avalanche energy, single pulse E I =-20A, R =25W 105 mJ AS D GS V 25 Gate source voltage V GS P T =25C 69 Power dissipation W tot A 2) 2.1 T =25C A Operating and storage temperature T , T -55 150 C j stg 1C (1 kV - 2 kV) ESD class JESD22-A114 HBM 260 Soldering temperature C IEC climatic category DIN IEC 68-1 55/150/56 1) J-STD20 and JESD22 Rev. 2.03 page 1 2013-01-08BSZ086P03NS3 G Parameter Symbol Conditions Values Unit min. typ. max. Thermal characteristics Thermal resistance, R - - 1.8 K/W thJC junction - case Thermal resistance, 2 2) R - - 60 6 cm cooling area thJA junction - ambient Electrical characteristics, at T =25 C, unless otherwise specified j Static characteristics V Drain-source breakdown voltage V =0V, I =-250mA -30 - - V (BR)DSS GS D Gate threshold voltage V V =V , I =-105A -3.1 -2.5 -1.9 GS(th) DS GS D V =-30V, V =0V, DS GS I Zero gate voltage drain current - - -1 A DSS T =25C j V =-30V, V =0V, DS GS - - -10 T =125C j I V =-25V, V =0V Gate-source leakage current - - -100 nA GSS GS DS R V =-6V, I =-20A Drain-source on-state resistance - 8.7 13.4 mW DS(on) GS D V =-10V, I =-20A - 6.5 8.6 GS D R Gate resistance - 2.2 - W G V >2 I R , DS D DS(on)max Transconductance g 30 43 - S fs I =-20A D 2) 2 Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. 3) See Fig. 3 for more detailed information Rev. 2.03 page 2 2013-01-08