Please note that Cypress is an Infineon Technologies Company. The document following this cover page is marked as Cypress document as this is the company that originally developed the product. Please note that Infineon will continue to offer the product to new and existing customers as part of the Infineon product portfolio. Continuity of document content The fact that Infineon offers the following product as part of the Infineon product portfolio does not lead to any changes to this document. Future revisions will occur when appropriate, and any changes will be set out on the document history page. Continuity of ordering part numbers Infineon continues to support existing part numbers. Please continue to use the ordering part numbers listed in the datasheet for ordering. www.infineon.comCYBLE-013025-00 CYBLE-013030-00 EZ-BLE WICED Module CYBLE-013025-00/CYBLE-013030-00, EZ-BLE WICED Module Power Consumption General Description One-second interval average: 120 A The CYBLE-0130XX-00 is a fully integrated Bluetooth Low Energy wireless module solution. The CYBLE-0130XX-00 Advertising Only Current (20-ms interval): 2.7 mA includes an onboard crystal oscillator, passive components, flash Cypress CYW20737 silicon low-power mode support memory, and the Cypress CYW20737 silicon device. Refer to the CYW20737 datasheet for additional details on the capabilities of Sleep: 50-A typical the silicon device used in this module. Deep Sleep (HIDOFF): 1.5-A typical The CYBLE-0130XX-00 supports peripheral functions (ADC and Functional Capabilities 2 PWM), as well as serial communication (UART, SPI, I C). The CYBLE-0130XX-00 includes a royalty-free Bluetooth LE stack 10-bit auxiliary ADC with nine analog channels compatible with Bluetooth 5.2 in a 14.5 19.2 2.25 mm Serial communications interface (compatible with Philips I2C package. slaves) The CYBLE-013025-00 includes 128 KB of onboard serial flash Serial peripheral interface (SPI) support for both master and memory and is designed for standalone operation. The slave modes CYBLE-013030-00 does not contain onboard flash, requiring an external host to control the module via HCI commands or an Four dedicated PWM blocks external host to perform a RAM upload procedure, where the uploaded code will then execute from RAM. The Bluetooth LE protocol stack supporting generic access profile CYBLE-013030-00 can also interface to external flash on the (GAP) Central, Peripheral, Observer, or Broadcaster roles host board. Programmable output power from 20 dbm to +4 dBm (steps The CYBLE-0130XX-00 is fully qualified by Bluetooth SIG and is of 4 dBm) targeted at applications requiring cost-optimized Bluetooth LE wireless connectivity. The CYBLE-013025-00 is footprint Benefits 1 compatible with the Cypress CYBLE-x120xx-00 module family. CYBLE-0130XX-00 provides all necessary components required Module Description to operate Bluetooth LE communication standards. Module size: 14.52 mm 19.20 mm 2.25 mm Proven hardware design ready to use Bluetooth LE 5.2 listed single-mode module Cost optimized for applications without space constraints QDID: 170023 Nonvolatile memory for self-sufficient operation Declaration ID: D055756 (CYBLE-013025-00 only) Certified to FCC, ISED, MIC, and CE regulations Over-the-air update capable for in-field updates Castelated solder pad connections for ease-of-use (CYBLE-013025-00 only) 128 KB on-module serial flash memory (CYBLE-013025-00) Bluetooth SIG qualified with QDID and Declaration ID 60-KB SRAM memory Fully certified module eliminates the time needed for design, development, and certification processes Up to 14 GPIOs WICED SMART provides an easy-to-use integrated design Temperature range: 30 C to +85 C environment (IDE) to configure, develop, and program a Bluetooth LE application Cortex-M3 32-bit processor Pre-programmed EZ-Serial firmware platform to allow for Supports RSA encryption/decryption and key exchange easy-to-use out of the box Bluetooth Low Energy connectivity mechanisms (up to 4 kbit) Maximum TX output power: +4.0 dbm RX Receive Sensitivity: 94 dbm Received signal strength indicator (RSSI) with 1-dB resolution Note 1. CYBLE-0130XX-00 global connections (Power, Ground, XRES, etc) are pad compatible with the CYBLE-x120xx-00 family of modules. Available GPIO and functions may not be 100% compatible with your design. A review of the pad location and function within your design should be complete to determine if the CYBLE-013025-00 is completely pad-compatible to the CYBLE-x120xx-00 modules. Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 002-19200 Rev. *D Revised July 5, 2021